756 passive component recommendation for datecode results

Electronics Forum: passive component recommendation for datecode (3)

Books for SMT

Electronics Forum | Tue Jan 16 20:34:17 EST 2007 | davef

DAVE�S BOOKSHELF ASSEMBLER�S ESSENTIALS Title: Soldering in ElectronicsAuthor: RJ Klein WassinkPublisher: Electrochemical PublicationsISBN: 090115024XPublication date: December 1989 I know, I know. The book was written in 1989!!!! I use this b

whitepaper for the lead pitch standard

Electronics Forum | Fri Oct 22 07:31:24 EDT 2004 | davef

We're unclear about what you're seeking, but in order to move the conversation along, are you looking for: IPC-SM-782A - Surface Mount Design & Land Pattern Standard ANSI Approved Get up-to-date land pattern recommendations for ball grid array pac

Industry News: passive component recommendation for datecode (2)

Guidelines for Design and Assembly Process Implementation for Bottom Termination Components Released by IPC

Industry News | 2011-05-03 22:50:52.0

Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.

Association Connecting Electronics Industries (IPC)

New Amazing Microelectronic Whitepaper on Transient Voltage Suppressor: The Best ESD Protection Solution for Advanced Applications is published

Industry News | 2021-12-15 10:44:52.0

An Opportunity to Learn to Eliminate the Guesswork when Selecting the Optimal TVS for Different Applications

New Yorker Electronics

Express Newsletter: passive component recommendation for datecode (751)

01005 production goes industry wide

01005 production goes industry wide 01005 production goes industry wide The introduction of the 01005 chip components in 2004 was a challenge to the whole electronics equipment assembly industry. The components’ miniature size made them difficult


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