Industry Directory | Distributor
Admired Services Electronic Components is a trusted distributor of obsolete and current electronic components. Products include military parts, semiconductors, passive components and ICs.
Global ETS, is the leader in independent electronics authentication and testing services. The GETS brand holds AS6171, AS9100, AS6081, and ISO17025 certifications, and is also a DLA/QTSL approved laboratory.
New Equipment | Test Equipment - Bond Testers
For Wire and Die Testing on Royce and Dage tester
New Equipment | Test Equipment - Bond Testers
Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bon
Electronics Forum | Mon May 22 10:41:50 EDT 2000 | Scott G
Can anybody provide information on shear testing of passive components. What standards are used etc. Thanks
Electronics Forum | Tue May 23 20:39:37 EDT 2000 | Dave F
Scott: Sounds like fun: � Solder joint strength in pull/shear varies with lead geometry, solder volume, lead metal/metallization, and the test method. � Among things, IPC-TM-650 talks to getting pads off-of boards. For instance: Method 2.4.8 is for
Used SMT Equipment | General Purpose Test & Measurement
Anritsu Company introduces the first battery-operated high power Passive Intermodulation (PIM) testing solution for the major wireless standards in use around the world. PIM is a form of interference generated by passive components that are normally
Used SMT Equipment | General Purpose Test & Measurement
We ship worldwide. Please feel free to contact us if you need further information. Agilent/Keysight 8163B Lightwave Multimeter Key Features & Specifications High resolution color display 2 slots for hosting power modules, return loss modules, c
Industry News | 2003-04-07 10:16:38.0
Portable Products and Optoelectronic Applications Still Hold Promise for Growth
Industry News | 2022-01-10 16:55:15.0
The SMTA Capital Chapter Officer team is excited to provide our members with a free technical webinar on "Use of Photonic Soldering to Rework Chip Components" presented by Dr. Vahid Akhavan, Global Application Engineer at NovaCentrix. The presentation will take place on January 20th at 12:00am EST.
Technical Library | 2012-12-26 14:18:24.0
Passive components including resistors, capacitors, inductors, and circuit-protection devices compose the highest percentage of all devices that are populated on today’s PCB assemblies. However, the successful isolation and testing of these components during ICT is perhaps the most challenging and the least understood of all modern-day validation practices.
Technical Library | 2020-12-10 15:49:40.0
Electronic assemblies should have longer and longer service life. Today there are partially demanded 20 years of functional capability for electronics for automotive application. On the other hand, smaller components, such as resistors of size 0201, are able to endure an increasing number of thermal cycles until fail of solder joints, so these are tested sometimes up to 4000 cycles. But testing until the end of life is essential for the determination of failure rates and the prognosis of reliability. Such tests require a lot of time, but this is often not available in developing of new modules. A further acceleration by higher cycle temperatures is usually not possible, because the materials are already operated at the upper limit of the load. However, the duration can be shortened by the use of liquids for passive tests, which allow faster temperature changes and shorter dwell times because of better heat transfer compared to air. The question is whether such tests lead to comparable results and what failure mechanisms are becoming effective. The same goes for active temperature cycles, in which the components itself are heated from inside and the substrate remains comparatively cold. This paper describes the various accelerated temperature cycling tests, compares and evaluates the related degradation of solder joints.
Separate precise SMD thin board, aluminum PCB, for special board , needs customization. If any question, just feel free to contact bella@qy-smt.com and browse Website?https://morel-equipment.com/
link:https://www.ascen.ltd/Blog/Solutio/493.html ASCEN PCB separator ASC-620 PCB cutting machine can use for cutting LED long board and also can use to the PCBA with the high component separate operation.It is the best way to replace the way to purch
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | Milpitas, California USA | Engineering,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking individuals specializing in materials lab testing to join our team. We have openin
Career Center | Milpitas, California USA | Clerical,Production,Quality Control,Research and Development,Technical Support
Winslow Automation, Inc. (aka Six Sigma), an industry leader in electronic component interconnect technology & related test and failure analysis services, is seeking a ‘hands on’ Materials Engineer to join our Test services team. This individual wi
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | seoul, South Korea | Engineering
I have 4 year process engineering in Motorola and 7 years service experience in Assemblen . 2 years in Mirtec AOI as service manager .
SMTnet Express July 11, 2013, Subscribers: 26149, Members: Companies: 13418, Users: 34911 Effect of BGA Reballing and its Influence on Ball Shear Strength by S. Manian Ramkumar Ph.D., Andrew J. Daya, Daniel B. Lewanda; Rochester Institute
SMTnet Express, January 9, 2014, Subscribers: 26467, Members: Companies: 13548, Users: 35610 Embedded Passive Technology by Hikmat Chammas; Honeywell International Embedded Passive Technology is a viable technology that has been reliably used
| https://unisoft-cim.com/crosschecking-pcb-component-footprint-and-bom-footprint.html
software crosschecking PCB component footprint and bom footprint. | Unisoft ≡ Menu Skip navigation For over 35 years, Intelligent PCB Manufacturing Automation Software Be production ready in minutes, not days
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
. Figure 3 shows sample microscopy images after printing, after component being placed, and after reflow. (a) (b) (c) Figure 3. Microscope images (a) after stencil printing (b) after component being placed (c) after reflow Shear test was performed using a
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