SMT Express, Issue No. 1 - from SMTnet.com Volume 1, Issue No. 1 Thursday, June 3, 1999 Tricks of the Trade Optimizing Time/Pressure Dispensing ofAdhesives by Chrys Shea Return to Previous Page Over the past
| http://etasmt.com/cc?ID=te_news_bulletin,9161&url=_print
. If the metal content in the solder paste is relatively high, especially if the printing time is too long, it is more likely to cause an increase in the metal content
Imagineering, Inc. | https://www.pcbnet.com/blog/identifying-and-correcting-solder-bridge-defects/
component placement Too much paste has been applied to pads Preheat temperature is not high enough Solder bridging causes electrical shorts, which can make printed circuit boards malfunction during use
