Industry Directory: paste in hole ratio (2)

Uniwell (HK) Electronics Co.,ltd (uwellpcb.com)

Industry Directory | Manufacturer

UWELLPCB.com is the PCB supplier. We offer PCB from single side board, double side PCB to 32layer board,including the Rigid PCB, Flex PCB, Rigid-flex PCB,Quick-turn prototype and PCB assembly

Sierra Circuits Inc.

Industry Directory | Manufacturer

A printed circuit board manufacturer producing high quality prototype printed circuit boards.

New SMT Equipment: paste in hole ratio (1)

PCB & Semiconductor Packaging Materials.

PCB & Semiconductor Packaging Materials.

New Equipment | Materials

Innovative Materials, Superior Performance. Our printed circuit board and semiconductor packaging materials provide superior thermal and mechanical performance, a fact we’ve prided ourselves on for over 45 years. All our materials are RoHS complian

i3 Electronics

Electronics Forum: paste in hole ratio (127)

Re: paste in hole

Electronics Forum | Fri Jun 25 12:07:00 EDT 1999 | John Thorup

| | hello, | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | thanks for the input | | | | wayne | | | | | | | We have tried this mainly on thru hole connect

Re: paste in hole

Electronics Forum | Fri Jun 25 11:05:19 EDT 1999 | Christopher Cross

| hello, | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | thanks for the input | | wayne | | | We have tried this mainly on thru hole connectors (.035 pins, .1 s

Industry News: paste in hole ratio (147)

Largest Dispensing Platform in the Industry

Industry News | 2017-04-11 21:19:32.0

GPD Global offers versatile large format inline dispensing systems and stand-alone liquid dispense technologies for maximizing product yield. This is the largest standard PCB dispensing system platform in the industry.

GPD Global

The Latest in Automatic Fluid Dispensing at IPC APEX EXPO 2024

Industry News | 2024-04-06 00:43:25.0

Live demos at IPC APEX Expo 2024 – Booth 1504 – April 9-11, 2024, Anaheim, CA GRAND JUNCTION, CO USA -- April 2024 -- GPD Global – manufacturer of precision fluid dispensing systems for high-volume 24/7, low-volume/high-mix, and R&D production – will exhibit in Booth 1504 at IPC APEX EXPO 2024 on April 9-11 in the Anaheim Convention Center, CA.

GPD Global

Parts & Supplies: paste in hole ratio (71)

Panasonic  KME nozzles used in smt machine

Panasonic KME nozzles used in smt machine

Parts & Supplies | SMT Equipment

Panasonic smt nozzles models: Panasonic MSR SMT NOZZLE Part Number Description 10468S0002 MSR - SMT NOZZLE - VVS (0.84 X 0.60) 10468S0003 - NZ. - VS (1.0 X 0.64) 10468S0004 -NZ. - S (1.6 X 1.06) 1046710134 -NZ. - M (1.60mm) 10467S0001 -NZ. - L

KingFei SMT Tech

Yamaha 212A Nozzle made in China

Yamaha 212A Nozzle made in China

Parts & Supplies | Other Equipment

YAMAHA 212A Nozzle YAMAHA NOZZLES: KHY-M7740-A0 NOZZLE 303A/314A ASSY KHN-M7720-A1 NOZZLE 302A ASSY KHN-M7710-A1 NOZZLE 301A ASSY KHN-M7710-A2 NOZZLE 301A ASSY KHY-M7720-A0X Nozzle 312A ASSY YVL88/YV100 PICK UP NOZZLE

Jinchen Electric Technology Co,.Ltd

Technical Library: paste in hole ratio (4)

PTH Core-to-Core Interconnect Using Sintered Conductive Pastes

Technical Library | 2013-03-07 18:25:36.0

The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias was once relatively small, and focused on specialized applications in the military and high end computing. The demand for these types of PCBs today is being driven by an increasing number of commercial applications in the telecommunications and semiconductor test market segments. These applications typically require high-aspect-ratio plated-through-holes (PTHs) and blind and buried vias in order to meet the applications interconnect density requirements. Blind and buried vias and high aspect ratio PTHs continue to present manufacturing challenges and frequently are the limiting features to achieving high fabrication yield... First published in the 2012 IPC APEX EXPO technical conference proceedings

Ormet Circuits, Inc.

Selective soldering in an optimized nitrogen atmosphere

Technical Library | 2021-09-29 13:35:21.0

In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.

Vitronics Soltec

Training Courses: paste in hole ratio (2)

Void Formation in Solder Joints - Causes & Cures - Online Webinar

Training Courses | | | PCB Assembly Courses

The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.

ASKbobwillis.com

IPC J-STD-001 Specialist (CIS) Certification Training Course

Training Courses | | | IPC J-STD-001 Specialist (CIS)

The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.

Skolnik Technical Training Institute, LLC

Career Center - Resumes: paste in hole ratio (2)

CAD CAM (SMT Stencil Design) Engr &Team leader

Career Center | Bangalore, India | Engineering,Maintenance,Production,Technical Support

SMT Stencil designing & Knowledge of full SMT process software known CAD/CAM -circuit CAM Pro 7.3,GC Power station, GCCAM Edit,Auto CAD, Fault finding of Electronic Boards & Servicing electronic machines.

Electronics Manufacturing /SMT/Quality/ISO/6 sigma

Career Center | , | 2013-03-07 05:50:27.0

Looking for Leader ship Opprtunity in Electronics Manufacturing Plant in India

Express Newsletter: paste in hole ratio (783)

SMTnet Express March 7 - 2013, Subscribers: 26214

SMTnet Express March 7, 2013, Subscribers: 26214, Members: Companies: 13311, Users: 34412 PTH Core-to-Core Interconnect Using Sintered Conductive Pastes The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias

Partner Websites: paste in hole ratio (2299)

Pin in Paste - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/pin-in-paste_topic3208.html

: 50 Post Options Post Reply Quote phil.holden Report Post    Thanks(0)    Quote    Reply Topic: Pin in Paste     Posted: 12 Jan 2023 at 8:09am Are there any plans for inclusion of a 'Pin in Paste' hole size calculator

PCB Libraries, Inc.

Ratio-Pak® Snap-Together Dual Cartridges | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/syringe-barrels-and-cartridges/ratio-pak-snap-together-cartridges

cartridges come in a variety of sizes and have the ability to snap together to combine multiple ratios. The unique, patented design allows end users to choose any ratio that their material may require, all the way up to 25:1

ASYMTEK Products | Nordson Electronics Solutions


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SMT feeders

Reflow Soldering 101 Training Course
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convection smt reflow ovens

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Electronic Solutions R3

500+ original new CF081CR CN081CR FEEDER in stock