Industry Directory | Manufacturer
Manufacturer of automated production systems;PCB magazine loader,PCB separator,PCB cutting machine,PCB unloaders, PCB conveyors,PCB depaneling machines,PCB turn conveyors,PCB conformal coaters,PCB solder paste printer,PCB buffer
Leading supplier of Solid Solder Deposit (SSD) technology and equipment to the electronics industry. Mask Tek's patented PPT process eliminates solder paste at assembly. Ideal for fine pitch and BGAs. Please visit our web site at masktek.com.
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Electronics Forum | Tue Apr 18 07:46:30 EDT 2017 | pavel_murtishev
Dear PCBFOX, I use CAM350 v12.2 build 1135. I am trying to use CAM350 DFMStream module for paste mask layer check. Examination I am interested in most of all is "Paste Mask Layer Check - Missing Paste Mask on SMD Pads (MP)", i.e. missing stencil ape
Electronics Forum | Thu Apr 06 05:20:05 EDT 2017 | pavel_murtishev
Good afternoon, I am looking for experienced CAM350 users here. I might have found a bug in DFMStream paste mask checks. If you have experience with CAM350, please reply and I will describe the issue. Any input would be really appreciated. Regards
Used SMT Equipment | Other Equipment
I have 2 Used working DEK 248 printers For Sale, they are working units. We use them for paste, but other ones we have re-purposed for Masking, Thermal Grease and at one time Thick Film. They are very good for fine pitch paste printing repeatabili
Used SMT Equipment | General Purpose Equipment
Contact AssuredTechnicalServiceLLC@Gmail.com for details: Package offers preferred: 1.) Protomat S103 Jetstream Dust Extraction System 4 Replacement Bags 3 new Vacuum table backers 1 used tight tolerance vacuum backer with sinter plate Solde
Industry News | 2016-07-16 13:32:29.0
Advanced dispense technology is available for integration into your dispensing system. Continuously Volumetric, drip-and-drool free dispense technology can now be retrofitted into your dispense robot. GPD Global's Volumetric PCD pumps ensure the success of applications like underfill, LED encapsulation, solder mask, silicones, conductive ink, conformal coatings, and more. Improve your throughput and yields by retrofitting a Volumetric PCD Pump into your dispense system to simplify the dispense process.
Industry News | 2016-12-09 23:33:42.0
GPD Global offers advanced dispense pump technologies to upgrade your existing platform and take advantage of existing capital equipment. Retrofit your system with innovative dispensing technology for excellent dispense control and repeatability.
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Parts & Supplies | Assembly Accessories
12MM Calibration Tape .12MM Calibration Tape 20 Inch Folding Bike Ravel Case 20 Inch Folding Bike ravel Case 4*4.1200pcs/bag M0604 8MM Calibration Tape .8MM Calibration Tape 90 degree drive set 90 degree drive set A2E BGA Rework Station Temp Con
Technical Library | 2010-03-18 14:02:03.0
Selecting products that have been qualified by industry standards for use in printed circuit board assembly processes is an accepted best practice. That products which have been qualified, when used in combinations not specifically qualified, may have resultant properties detrimental to assembly function though, is often not adequately understood. Printed circuit boards, solder masks, soldering materials (flux, paste, cored wire, rework flux, paste flux, etc.), adhesives, and inks, when qualified per industry standards, are qualified using very specific test methods which may not adequately mimic the assembly process ultimately used.
Technical Library | 2019-09-24 15:41:53.0
This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications. The coatings consist of: Specialty (green transparent) liquid photoimageable solder masks (LPiSM) compatible with long-term thermal storage/stress in excess of 150°C. Combined with the appropriate high-temperature base material, and along with a suitable copper pre-treatment, these solder resists are capable of fulfilling higher thermal demands. In this context, long-term storage tests as well as temperature cycling tests were conducted. Moreover, the effect of various Cu pre-treatment methods on the adhesion of the solder masks was examined following 150, 175 and 200°C ageing processes. For this purpose, test panels were conditioned for 2000 hours at the respective temperatures and were submitted to a cross-cut test every 500 h. Within this test set-up, it was found that a multi-level chemical pre-treatment gives significantly better adhesion results, in particular at 175°C and 200°C, compared with a pre-treatment by brush or pumice brush. Also, breakdown voltage as well as tracking resistance were investigated. For an application in LED technology, the light reflectivity and white colour stability of the printed circuit board are of major importance, especially when high-power LEDs are used which can generate larger amounts of heat. For this reason, a very high coverage power and an intense white colour with high reflectivity values are essential for white solder masks. These "ultra-white" and largely non-yellowing LPiSM need to be able to withstand specific thermal loads, especially in combination with high-power LED lighting applications. The topic of thermal performance of coatings for electronics will also be discussed in view of printed heatsink paste (HSP) and thermal interface paste (TIP) coatings which are used for a growing number of applications. They are processed at the printed circuit board manufacturing level for thermal-coupling and heat-spreading purposes in various thermal management-sensitive fields, especially in the automotive and LED lighting industries. Besides giving an overview of the principle functionality, it will be discussed what makes these ceramic-filled epoxy- or silicone-based materials special compared to using "thermal greases" and "thermal pads" for heat dissipation purposes.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | Brockton, Massachusetts USA | Production
Responsible for the programming, setup, complete maintenance, and troubleshooting of circuit board assembly line equipment and processes including, but not limited to, surface mount assembly machines, screen printer, pick and place machine, reflow ov
Career Center | Auckland, New Zealand | Engineering
NAVMAN PCBA NPI Engineer Reporting To: PCBA NPI Technical Leader Primary Objective: Transition of PCBs from R&D design to a manufacturable state conforming to all facets of PCBA production Secondary: Develop DFM & best practice guidelines Res
Career Center | Lalkua, India | Engineering,Maintenance,Production,Quality Control,Research and Development,Technical Support
Machine maintenance Service and support knowledge with customer satisfactory. Deal with customers at all level via phone,remote and mail.Sound knowledge of PCB fabrication machine.
Career Center | NORTHRIDGE, California USA | Engineering
EDUCATION BS Electronics and Communication Engineering Gujarat University MS Electrical Engineering California State University, Northridge ACADAMIC PROJECT Fabrication and Characterization of Silicon Carbide (SiC) MESFE
GPD Global | https://www.gpd-global.com/pin-paste-dispensing-through-hole.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/fluid-types/solder-paste?con=t&page=3
: Solder Paste SMTA Space Coast Expo & Tech Forum 2016 Nordson ASYMTEK Register for FREE and come talk with us about your precision dispensing and conformal coating applications Solder Mask Nordson ASYMTEK These products are recommended
