Versatile reflow oven for medium volume soldering (leadfree or leaded solder). 400 mm process width. Integrated microprocessor for profile control and storage. Extra high air volume for perfect soldering of complex boards. 5 zone reflow oven 400
Electronics Forum | Fri Jul 24 16:03:56 EDT 1998 | Boris Akselrud
Dave, Thanks for your responce. I think I can manage to solder components by hand. But I am trying to find out an alternative way to solder them. The distance between leads becomes very small and if solder gets in between them I will have hard times
Electronics Forum | Wed Sep 22 14:45:01 EDT 2004 | Michelle Ogihara
As many people have participated in this email string, including competitors and customers of Sawa, I would like to respond to especially one rather detailed email expressing concerns with this stencil cleaning system. Also, this teaches me to keep
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Previous Page BGA REWORK Earl Moon Proof Of Design (POD) SOLDER PASTE APPLICATION (WHEN AND AS SPECIFIED) Select
| http://etasmt.com/cc?ID=te_news_industry,24163&url=_print
. Defects caused by improper design of surface-mount PCBs, solder paste printing and component mounting will eventually find expression in soldered products
