Industry Directory | Manufacturer
Nitrogen Cast Lead Free solder Manufacturer, complete range of No Clean and No Residue fluxes Misprint Cleaning Systems completely compressed air driven low cost with no need for electrics 18x12
New Equipment | Solder Paste Stencils
Product material: stainless steel (internal) + steel plate baking paint Storage quantity: 36 cans of tin paste Product weight: 13kg Product size: 495 * 750 * 95mm Application: SMT workshop solder paste storage control, first in, first out
Hanwha Decan S2 SMT Assembly line Decan S2 SMT Assembly Line Decan S2 SMT Assembly Line SMT PCB production Full Automatic Assembly line Speed:158000CPH Product description: Hanwha Decan S2 SMT Assembly line, Speed 158000CPH INQUIRY Ha
Electronics Forum | Mon Dec 14 18:45:08 EST 2009 | gregoryyork
why not use a paste where it requires no refrigeration at all cheers Greg
Electronics Forum | Thu Dec 10 12:53:12 EST 2009 | deanm
Bryan, Dyoungquist is correct. You should not need to mix solder paste. Overmixing solder paste can adversely affect it. Follow these guidelines and you should be fine: 1. Keep unopened containers of paste in the refrigerator. 2. Take one container
Used SMT Equipment | Soldering - Reflow
The SMRO-4000 Scirocco Reflow oven has been developed for reflow soldering of Hybrid boards, SMT boards and Curing Glue or thin film pastes. The machine is developed for medium to large series of assembly. The Scirocco is based on hot air convection.
Used SMT Equipment | Soldering - Reflow
The SMRO-4000 Scirocco Reflow oven has been developed for reflow soldering of Hybrid boards, SMT boards and Curing Glue or thin film pastes. The machine is developed for medium to large series of assembly. The Scirocco is based on hot air convection.
Industry News | 2018-10-18 08:27:03.0
An Analysis of SMT Solder Paste Printing Defects
Industry News | 2018-12-08 03:35:10.0
Top 10 Consumer Electronics Companies in the World
A collection of old manufacturing pictures.
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
