Industry Directory | Manufacturer
Cookson Electronics is a leading materials science company that provides high performance materials, Soldering Pastes
Industry Directory | Manufacturer
A materials supplier to the electronics industry. Our breadth of products includes Solder Paste, Solder Preforms, Stencils, Liquid Soldering Flux, Soldering Alloys, Cored Wire, Adhesives, Cleaners and Sinter Technologies
New Equipment | Assembly Services
Hanwha HM510 SMT Assembly Line Hanwha HM510 SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 60000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place ma
New Equipment | Assembly Services
Hanwha HM510 SMT Assembly Line Hanwha HM510 SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 60000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place ma
Electronics Forum | Wed Mar 21 07:44:19 EDT 2012 | cuervo
Hello ! I have a vitronics 500s ( five zones), and the solder paste is ALPHA OM-338-PT lead free. have anyone a profile to start and test, i need some reference temperatures.and conveyor speed thanks !!!
Electronics Forum | Thu Apr 06 16:42:44 EDT 2006 | russ
this is all good jay but would WML have to say about this paste? I'm gonna wait for his response before I do anything! I am bringing in some samples of this soon to try for myself. I have a part that the manufacturer says to run with a paste with n
Industry News | 2020-01-08 16:51:58.0
The SMTA Capital Chapter is excited to host a Chapter Meeting on February 20th from 5:00 PM to 7:30 PM at PACE Worldwide in Elkridge, MD. Jason Fullerton, MacDermid Alpha Electronic Solutions, will be presenting “Advances in Lead-Free Solder Technologies for High Reliability Applications.”
Industry News | 2021-02-05 09:31:21.0
The SMTA is pleased to announce the Best Papers from SMTA International 2020. The winners were selected by members of the conference technical committee. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.
Technical Library | 2017-07-13 16:16:27.0
Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles, subject to a direct current (D.C.) bias voltage are recognized by a number of global standards organizations as the preferred method to determine if no clean solder paste and wave soldering flux residues are suitable for reliable electronic assemblies. The IPC, Japanese Industry Standard (JIS), Deutsches Institut fur Normung (DIN) and International Electrical Commission (IEC) all have industry reviewed standards using similar variations of this measurement. (...) This study will compare the results from testing two solder pastes using the IPC-J-STD-004B, IPC TM-650 2.6.3.7 surface insulation resistance test, and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.
Technical Library | 2019-10-16 23:18:15.0
Despite being a continuous subject of discussion, the existence of voids and their effect on solder joint reliability has always been controversial. In this work we revisit previous works on the various types of voids, their origins and their effect on thermo-mechanical properties of solder joints. We focus on macro voids, intermetallics micro voids, and shrinkage voids, which result from solder paste and alloy characteristics. We compare results from the literature to our own experimental data, and use fatigue-crack initiation and propagation theory to support our findings. Through a series of examples, we show that size and location of macro voids are not the primary factor affecting solder joint mechanical and thermal fatigue life. Indeed, we observe that when these voids area conforms to the IPC-A-610 (D or F) or IPC-7095A standards, macro voids do not have any significant effect on thermal cycling or drop shock performance.
ALPHA® Preforms with solder paste adds solder volume.
Adding ALPHA® solder preforms to solder paste can result in complete hole fill in electronic assembly pin in through hole soldering applications. www.alpha.alent/products/preforms
Career Center | South Plainfield, New Jersey USA | Engineering
Alpha, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED ligh
Career Center | South Plainfield, New Jersey USA | Engineering,Research and Development
MacDermid Alpha Electronics Solutions, a world leader in the development, manufacturing, and sales of innovative materials used in the assembly electronics, industrial joining and Photo Voltaic market places, is seeking a Scale-Up Technician/Chemist&
Career Center | seoul, South Korea | Engineering
I have 4 year process engineering in Motorola and 7 years service experience in Assemblen . 2 years in Mirtec AOI as service manager .
Career Center | Calamba City, Laguna Philippines | Engineering
Electronic Manufacturing Services (EMS) – SMT-EOL Process Engineer (August 2005 – Present) • Responsible for feasibility study for existing product and new product and conceptualize product assembly or process flow taking into consideration the manu
on volume delivery and positioning accuracy for solder p
