The Surface Finish Effect on the Creep Corrosion in PCB SMTnet Express May 10, 2012, Subscribers: 25098, Members: Companies: 8865, Users: 33085 The Surface Finish Effect on the Creep Corrosion in PCB First published in the 2012 IPC APEX EXPO
Virtual Access Technique Augments Test Coverage on Limited Access PCB Assemblies SMTnet Express May 3, 2012, Subscribers: 25098, Members: Companies: 8863, Users: 33057 Virtual Access Technique Augments Test Coverage on Limited Access PCB Assemblies
Blackfox Training Institute, LLC | https://www.blackfox.com/about/instructors/
Surface Mount processes, Through-Hole and Mixed Technology processes, Testing operations such as ICT/Functional, final Box Build assembly processes and Bare Board Fabrication processes
| https://www.smtfactory.com/How-to-Assemble-the-Processing-Technology-of-SAMSUNG-Pick-Place-Machine-id3828279.html
: www.smtfactory.com Inquire On the traditional THT printed circuit board, the components and solder joints are located on both sides of the board, while on the SAMSUNG Pick & Place Machine
