Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Standards Setting / Certification / Training Provider
EPTAC is an internationally recognized solder training and IPC certification corporation, giving professionals the skills to accelerate their careers, and businesses the talent to succeed.
New Equipment | Education/Training
IPC A-600H Acceptability of Electronic Assemblies. The IPC-A-600, "Acceptability of Printed Boards " is the most widely used published specification on printed wiring boards. This specification has set the standard for rigid printed boards in terms o
New Equipment | Solder Paste Stencils
MPM UP2000 HiE Screen Printer Substrate treatment Minimum/maximum size 2"x 2"(50.0 mm x50.0 mm) to 20" x 16" (508 mm x 406 mm)(16 "or larger substrate requires special clamps
Used SMT Equipment | Conveyors
Nutek Open LIFO, XXL-size Type: NTM650SXXL Serial Nr.: 2012-0810E01 Year of Manufacture: 2013 Direction: Left to Right Transfer height: 900mm (+/-25mm) PCB size: 50 – 535mm (W)/ 80 -850mm (L) Product thickness: 0.60 – 1.60mm Component Height: Top: 30
Used SMT Equipment | Conveyors
Nutek Dual Track belt FIFO Type: NTM660DT Serial Nr.: 2015-0471A01 Year of Manufacture: 2015 Direction: Left to Right, Front track front fix, Rear track rear fix Transfer height: 950mm (+25/-40mm) PCB size: 75 – 260mm (W)/ 80 -330mm (L) Product thick
Industry News | 2003-07-02 08:46:01.0
A full range of PCB mount SSRs are available on the compact DIN Rail assembly.
Industry News | 2003-05-12 09:19:51.0
No larger than conventional 12A wire-to-board connectors for PCB applications
Technical Library | 2008-04-15 14:43:08.0
The increasing demands for miniaturization and better functionality of electronic components and devices have a significant effect on the requirements facing the printed circuit board (PCB) industry. PCB manufactures are driving for producing high density interconnect (HDI) boards at significantly reduced cost and reduced implementation time. The interconnection complexity of the PCB is still growing and today calls for 50/50 μm or 25/25 μm technology are real. Existing technologies are unable to offer acceptable solution. Recently the Laser Direct Imaging (LDI) technology is considered as an answer for these challenges.
Unipress - Institute of High Pressure Physics of the Polish Academy of Sciences
Technical Library | 2023-08-04 15:38:36.0
The MicroLeadFrame® (MLF®)/Quad Flat No-Lead (QFN) packaging solution is extremely popular in the semiconductor industry. It is used in applications ranging from consumer electronics and communications to those requiring high reliability performance, such as the automotive industry. The wide acceptance of this packaging design is primarily due to its flexible form factors, size, scalability and thermal dissipation capabilities. The adaptation and acceptance of MLF/QFN packages in automotive high reliability applications has led to the development of materials and processes that have extended its capabilities to meet the performance and quality requirements. One of process developments that is enabling the success of the MLF/QFN within the automotive industry has been the innovation of side wettable flanks that provide the capability to inspect the package lead to printed circuit board (PCB) interfaces for reliable solder joints. Traditionally, through-board X-ray was the accepted method for detecting reliable solder joints for leadless packages. However, as PBC layer counts and routing complexities have increased, this method to detect well-formed solder fillets has proven ineffective and incapable of meeting the inspection requirements. To support increased reliability and more accurate inspection of the leadless package solder joints, processes to form side-wettable flanks have been developed. These processes enable the formation of solder fillets that are detectable using state-of-the-art automated optical inspection (AOI) equipment, providing increased throughput for the surface mount technology (SMT) processes and improved quality as well.
This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
This video describes the IPC A-600 training and certification program. The IPC A-600 specification is a set of acceptability specifications for printed circuit boards. These standards determine the acceptance and reject criteria for printed wiring bo
Training Courses | ON DEMAND | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Training Courses | ON DEMAND | | IPC-600 Specialist (CIS) Recert.
The Certified IPC-600 Specialist (CIS) training focuses on the area of quality assurance of bare printed circuit boards.
Events Calendar | Wed Mar 17 18:30:00 UTC 2021 - Wed Mar 17 18:30:00 UTC 2021 | ,
India Chapter Webinar: PCBA Process Qualifications
Events Calendar | Tue Apr 20 18:30:00 UTC 2021 - Tue Apr 20 18:30:00 UTC 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Career Center | Springfield, Virginia USA | Production
We need someone who is excellent at hand solder of through hole and SMT componets to pcb. Must be capable and content performing the task. IPC certification helpful but will accept experienced person that can perform the task to IPC standards.
Career Center | Kingston, Ontario, Ontario Canada | Sales/Marketing
We are a PCB manufacturer located in China and right now we have set up our office in Ontario, Canada. We can produce high-quality PCBs up to 24 layers and we accept orders for prototypes as well as large volumes, both with very competitive prices. W
Career Center | Hyderabad, Telangana India | Engineering,Maintenance,Production
Experience in handling Process related issues throughout the Product Manufacturability. Programming and maintenance of SMT Pick and Place Machines of Mirae, Panasonic, NXT and MyData Programming and maintenance of Solder Paste Printer of DEK
Career Center | reston, Virginia USA | Engineering,Management,Production,Technical Support
NIGEL COOMBER (703 715 1075) email: ncoomber@yahoo.com OBJECTIVE: To contribute in a position of high responsibility for a progressive technically innovative company which can utilize a highly motivated professional with leading edge experience in a
SMT Express, Issue No. 2 - from SMTnet.com Volume 1, Issue No. 2 Wednesday, July 14, 1999 Featured Article Return to Front Page THE LABORATORY A PRIMARY EVALUATION AND QUALIFICATION FACTOR TO DETERMINE PCB SUPPLIER PROCESS CAPABILITIES Earl
| https://www.eptac.com/faqs/ask-helena-leo/ask/pcb-design-for-conformal-coating
? I can locate acceptance criteria in IPC-CC-830/IPC-HDBK-830 /MIL-I-46058C for coated PCB assemblies, but little information related to the PCB design end. Answer
Imagineering, Inc. | https://www.pcbnet.com/blog/ipc-guidelines-ensuring-quality-pcb-prototyping/
. There’s an IPC standard for each phase of printed circuit board (PCB) production and delivery: Design, output Assembly , production Acceptance Purchasing How IPC Standards Ensure PCB Manufacturing Quality Original equipment manufacturers (OEMs
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