New Equipment | Assembly Services
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New Equipment | Assembly Services
https://www.cnsmtline.com/smt-conveyor/ smt conveyor belt smt conveyor belt replacement smt buffer conveyor smt cooling conveyor smt conveyors for sale smt inspection conveyor smt pcb in
Electronics Forum | Sun Nov 01 01:33:52 EST 2009 | isd_jwendell
Just my opinion: Top pic - Solder mask registration WAY too far off, without a doubt I would reject. Bottom pic - I would worry that there was/is a contamination that caused the poor looking mask. This may be cosmetic only, but unknown. I would rej
Electronics Forum | Fri Jan 15 05:33:05 EST 2016 | jvercamm
hi, I would like to know if SMD parts (soic, small qfp, large qfp and tsop parts) can be programmed before PCB assembly and, if true, which companies can do this. These parts are either embedded microcontrollers with flash memory, flash memory and
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Industry News | 2016-06-27 14:59:09.0
GPD Global introduces the NEW TempView Thermal Imaging System that ensures the success of heated dispensing processes like Underfill, Encapsulations, Dam and Fill, and more. The TempView Thermal Imaging System monitors the temperature of the entire substrate for complete heat profile characterization. Regions of the product may be selected for monitoring during the heating process. Now you can accurately monitor temperature of specific devices to be sure they are up to temperature before starting a process.
Parts & Supplies | Pick and Place/Feeders
more than we can offer contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 motor JUKI KE730 Z Axis Motor L404-151EL8 JUKI KE730 T Axis Motor L402-021EL0 23W 24V 1.9A JUKI KE750 X Axis Motor TS4513N1820E200 E9611721000 JUKI K
Parts & Supplies | Pick and Place/Feeders
more than we can offer contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 motor JUKI KE730 Z Axis Motor L404-151EL8 JUKI KE730 T Axis Motor L402-021EL0 23W 24V 1.9A JUKI KE750 X Axis Motor TS4513N1820E200 E9611721000 JUKI K
Technical Library | 2016-11-30 15:53:15.0
The use of microvias in Printed Circuit Boards (PCBs) for military hardware is increasing as technology drives us toward smaller pitches and denser circuitry. Along with the changes in technology, the industry has changed and captive manufacturing lines are few and far between. As PCBs get more complicated, the testing we perform to verify the material was manufactured to our requirements before they are used in an assembly needs to be reviewed to ensure that it is sufficient for the technology and meets industry needs to better screen for long-term reliability. The Interconnect Stress Testing (IST) protocol currently used to identify manufacturing issues in plated through holes, blind, or buried vias are not necessarily sufficient to identify problems with microvias. There is a need to review the current IST protocol to determine if it is adequate for finding bad microvias or if there is a more reliable test that will screen out manufacturing inconsistencies. The objective of this research is to analyze a large population of PCB IST coupons to determine if there is a more effective IST test to find less reliable microvias in electrically passing PCB product and to screen for manufacturing deficiencies. The proposed IST test procedure will be supported with visual inspection of corresponding microvia cross sections and Printed Wiring Assembly (PWA) acceptance test results. The proposed screening will be shown to only slightly affect PCB yield while showing a large benefit to screening before PCBs are used in an assembly.
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
Hot Sale pcb Push-up stacker for chip mounter Assembly Line Product introduction: 1.This equipment is used to collect bare PCBs at the end of SMT production line 2.Stable and reliable PLC control system; 3.Easy to operate LED touch screen control
Events Calendar | Thu Jun 08 00:00:00 EDT 2023 - Thu Jun 08 00:00:00 EDT 2023 | ,
SMTA Workforce Development Webinar: PCB Design Courses and Careers in PCB Design
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PROFESSIONAL EXPERIENCE: Connected in the field of manufacturing/electronics industry experienced in the line, Through Hole and Surface Mount Technology, worked on various Fuji Machines Universal model, such as: CP 643E chip shooter QP 242E chip mou
SMTnet Express July 25, 2013, Subscribers: 34972, Members: Companies: 13435, Users: 34972 Using Automated 3D X-Ray Inspection to Detect BTC Defects by Barbara Koczera; Test Research USA , An Qi Zhao; Flextronics Detecting marginal joints and other
SMTnet Express July 18, 2013, Subscribers: 26169, Members: Companies: 13430, Users: 34947 Effect of Surface Oxide on the Melting Behavior of Lead-Free Solder Nanowires and Nanorods by Fan Gao, Karunaharan Rajathurai, Qingzhou Cui, Guangwen Zhou
| https://www.eptac.com/blog/continuous-training-education-are-critical
-quality and reliable printed circuit board (PCB) assembly. One way to demonstrate proficiency in PCB assembly is... Read More Get valuable tips and techniques emailed directly to you
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your search Close Search High-quality PCB fabrication & assembly The biggest brands in the world choose Imagineering for their printed circuit board fabrication and assembly. We've expanded
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