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Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Industry Directory | Equipment Dealer / Broker / Auctions / Manufacturer
Focusing on the SMT field for more than 18 years, kinds of smt spare parts,like feeder ,nozzles,motors,fitlers and smt machine,juki ,panasonic ,yamaha,siemens,samsung(hanhua) ; peripheral equipment ,conveyor,AOI,spi,reflow oven
http://www.flason-smt.com/product/Siemens-12mm-16mm-original-feeder-00141092.html Siemens 12mm 16mm original feeder 00141092 SMT Spare Parts Seimens feeder Siemens 12mm 16mm original feeder 00141092 Usage: Seimens pick and place machine Produ
New Equipment | Assembly Services
Hanwha HM520 HS SMT Assembly Line Hanwha HM520 HS SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 80000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and pl
Electronics Forum | Thu Jul 29 12:33:38 EDT 1999 | Wolfgang Busko
| Currently, we are baking any PCB before process on SMT, the 'reason' is to dry any possible humidity that could be inner the PCB, it does not matter if the PCB is multilayer or not. We bake PCB's at 107C for 4 hrs and the board must be process into
Electronics Forum | Thu Jul 12 02:15:53 EDT 2012 | thmeier
Check also the specs / recommendations of your PCB manufacturer. We bake boards 4h/120°C before reflow and after automated cleaning (it´s not FR4!) and also if we have to rework with the autometd rework- stations (massive IR underheating ,..). Regar
Used SMT Equipment | Soldering - Reflow
Still running production unit new unit delivered before the end of the year. The Heller 1809 MK5 is a reflow soldering system used in electronics manufacturing. Here are some key specifications and features: Model: 1809 MK5 Heating Zones: 9 Zones
Used SMT Equipment | AOI / Automated Optical Inspection
R Front Rail Fixed Application Version: 7.20C (RNS) Ladder Version: 7.100B (RNS) Image Resolution: 15um AC 120V, 2 Phase, 50/60 Hz, 1.5 kVA Max Current: 15A Hardware Configuration: Image Signal Input Unit: - Camera: 3-CCD Camera - Illumi
Industry News | 2024-09-18 14:19:59.0
Make sure you head over to the catalog and place your best and final bids ASAP!
Industry News | 2021-06-08 09:22:40.0
Baja Bid is hosting an online auction event featuring items from: Mydata, DEK, Vitronics, Universal and much more. The bidding period began yesterday, June 7, at 8:00am EST. The bidding period will begin closing tomorrow, June 9, at 1pm EST.
Parts & Supplies | Pick and Place/Feeders
Many companies first applied SMT second-hand placement machines, and the selected placement machines were relatively stable, with low failure rate, easy maintenance, and important maintenance costs. Therefore, there are still many concerns about buyi
Parts & Supplies | Pick and Place/Feeders
Many companies first applied SMT second-hand placement machines, and the selected placement machines were relatively stable, with low failure rate, easy maintenance, and important maintenance costs. Therefore, there are still many concerns about buyi
Technical Library | 2024-09-02 18:48:58.0
The conversion to higher temperature "Lead Free" assembly reflow conditions has created an increased awareness that entrapped or absorbed moisture is a frequent root cause of thermally induced delamination at assembly reflow. There are two connected failure modes from entrapped moisture; incomplete resin cross-linking resulting in premature resin decomposition and also severe Z axis expansion from "explosive vaporization of the entrapped moisture at elevated temperatures at assembly reflow". Ultimately, both result in delamination failure. Other papers have shown the negative effects of entrapped moisture before lamination including delamination, red color, reduced thermal reliability and increased high speed signal loss. In this paper, various materials were tested for moisture sensitivity during lamination. Tests were performed at varying lamination conditions including a pre-vacuum step and "kiss" step. Pressure and cure temperature parameters were evaluated for minimizing or eliminating the effect of trapped moisture. Also included are the results of inner layer moisture removal baking conditions and their effect on peel strength and thermal reliability.
Technical Library | 2019-09-19 00:28:48.0
The symbiotic relationship between solder masks and selective finishes is not new. The soldermask application is one of the key considerations to ensure a successful application of a selective finish. The selective finish is the final chemical step of the PCB manufacturing process, this is when the panels are at their most valuable and are unfortunately not re-workable. Imperfections are not tolerated, even if they are wholly cosmetic. Quality issues often manifest themselves in the form of a 'ping pong' conversation between the fabricators, the soldermask suppliers and the selective finish suppliers. Without tangible evidence these discussions are difficult to resolve and the selective finish process is usually regarded as responsible. This paper will focus on the chemical characteristics and use them to predict or identify potential issues before they occur rather than specifically name 'critical' soldermasks. It is also the intention of this paper to address the potential of a soldermask to react to common yield hiking practices like UV bumping and oven curing. It is hoped that this awareness will help fabricators to ensure maximum yields by asking the right questions. 'Critical’ soldermasks impact all selective finishes. In this paper, practical experience using immersion tin will be used to highlight the relationship between 'critical' soldermasks and some of the issues seen in the field. The paper will include a novel approach to identify re-deposited volatiles after the reflow.
0.5M automatic inspection pcb conveyor and PCB Belt Conveyor|PCB transfer conveyor used for equipment linking, visual inspection, manual assembly, and PCB buffering functions https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/179.htm
ETA T Series Lead Free Reflow Oven If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. Reflow Oven, Reflow Soldering, Reflow Soldering Oven, SMT
Events Calendar | Sun Sep 27 00:00:00 EDT 2020 - Thu Oct 01 00:00:00 EDT 2020 | Rosemont, Illinois USA
SMTA International 2020 Conference & Exhibition
Career Center | Theni, Tamilnadu India | Engineering
NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu
Career Center | THRISSUR, India | Maintenance,Production
HANDLING OF MAINTENANCE Camelot,Mascot, Selective Soldering,Wave Soldering,Aquastorm 200,H-500 HI-Z,Kolb,kerry&PBT,GETECH, ATI 105 & Final Touch 101,Heller,Btu&vapour phase,Shuttle,SRT,ESD ,Electrical maintenance . Knowledge in using SLIM KIC 2000&
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What Tests are Required for a Qualified Reflow Oven Before it Shipped to The Customer?-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Home About
| https://www.smtfactory.com/What-Tests-are-Required-for-a-Qualified-Reflow-Oven-Before-it-Shipped-to-The-Customer-id3385161.html
What Tests are Required for a Qualified Reflow Oven Before it Shipped to The Customer? - Dongguan Intercontinental Technology Co.,Ltd. English Türk dili Tiếng Việt 한국어 日本語
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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