Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer
Focusing on the SMT field for more than 18 years, kinds of smt spare parts,like feeder ,nozzles,motors,fitlers and smt machine,juki ,panasonic ,yamaha,siemens,samsung(hanhua) ; peripheral equipment ,conveyor,AOI,spi,reflow oven
Industry Directory | Consultant / Service Provider / Manufacturer
Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD，PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.
New Equipment | Board Handling - Conveyors
http://www.flason-smt.com/product/PCB-Conveyor-for-LED-Production-Line-SMT-Assembly-Line.html PCB Conveyor for LED Production Line SMT Assembly Line Weight Approx.55Kg-85kg PCB Width: 50 to 350 mm Application: SMT PCB Assembly Production Power
New Equipment | Cleaning Equipment
SMT PCB Cleaner UC-250M Adhesive roll 2 rolls Width adjustment Manual PCB size 50﹡50~330﹡250 mm Weight About 100 kg Product description: SMT PCB Cleaner UC-250M, Adhesive roll 2 rolls, Width adjustment Manual, PCB size 50﹡50~330﹡250 mm, Weight
Used SMT Equipment | Soldering - Reflow
Still running production unit new unit delivered before the end of the year. The Heller 1809 MK5 is a reflow soldering system used in electronics manufacturing. Here are some key specifications and features: Model: 180
Used SMT Equipment | AOI / Automated Optical Inspection
R Front Rail Fixed Application Version: 7.20C (RNS) Ladder Version: 7.100B (RNS) Image Resolution: 15um AC 120V, 2 Phase, 50/60 Hz, 1.5 kVA Max Current: 15A Hardware Configuration: Image Signal Input Unit: - Camera: 3-CCD Camera - Illumi
Industry News | 2024-09-18 14:19:59.0
Make sure you head over to the catalog and place your best and final bids ASAP!
Industry News | 2021-06-08 09:22:40.0
Baja Bid is hosting an online auction event featuring items from: Mydata, DEK, Vitronics, Universal and much more. The bidding period began yesterday, June 7, at 8:00am EST. The bidding period will begin closing tomorrow, June 9, at 1pm EST.
Technical Library | 2024-09-02 18:48:58.0
The conversion to higher temperature "Lead Free" assembly reflow conditions has created an increased awareness that entrapped or absorbed moisture is a frequent root cause of thermally induced delamination at assembly reflow. There are two connected failure modes from entrapped moisture; incomplete resin cross-linking resulting in premature resin decomposition and also severe Z axis expansion from "explosive vaporization of the entrapped moisture at elevated temperatures at assembly reflow". Ultimately, both result in delamination failure. Other papers have shown the negative effects of entrapped moisture before lamination including delamination, red color, reduced thermal reliability and increased high speed signal loss. In this paper, various materials were tested for moisture sensitivity during lamination. Tests were performed at varying lamination conditions including a pre-vacuum step and "kiss" step. Pressure and cure temperature parameters were evaluated for minimizing or eliminating the effect of trapped moisture. Also included are the results of inner layer moisture removal baking conditions and their effect on peel strength and thermal reliability.
Technical Library | 2021-09-29 13:35:21.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.
ETA T Series Lead Free Reflow Oven If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. Reflow Oven, Reflow Soldering, Reflow Soldering Oven, SMT
ETA Pyxis Series CBS Reflow Oven If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. Reflow Oven, Reflow Soldering, Reflow Soldering Oven,
Events Calendar | Sat Sep 26 18:30:00 UTC 2020 - Wed Sep 30 18:30:00 UTC 2020 | Rosemont, Illinois USA
SMTA International 2020 Conference & Exhibition
Career Center | Kolkata, West Bengal India | Maintenance,Production,Technical Support
1.Company Name :Siemens Ltd.,Kalwa, Mumbai Department :Switchgear, Quality Control Job responsibilities :a)Checking and testing and troubleshooting of all types of switches in 240v and 440v range. Period : 1989 � 1990 2. Company Name
Career Center | , India | Engineering,Maintenance,Production,Technical Support
Work closely with production department in achieving production targets by continually supporting the production team. Setting up Process parameters for Critical process such as Solder Paste Printing, Reflow Soldering, Wave Soldering, BGA Rework
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What Tests are Required for a Qualified Reflow Oven Before it Shipped to The Customer?-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Home About
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What Tests are Required for a Qualified Reflow Oven Before it Shipped to The Customer? - Dongguan Intercontinental Technology Co.,Ltd. English Türk dili Tiếng Việt 한국어 日本語
