New Equipment | Test Equipment
3D Deformation Measurement with Akrometrix TherMoiré and Digital Fringe Projection. Akrometrix' patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage. First introduced in 1998 for us
Electronics Forum | Tue Aug 28 08:28:30 EDT 2012 | rgduval
We agree with all of the previous comments, and would add the following: Warpage is generally caused by excess moisture in the raw boards. Have you tried baking the boards prior to assembly? We had this issue on a simple 4-layer board, and found t
Electronics Forum | Thu Oct 14 20:42:07 EDT 1999 | Jeff Ferry
Grace, As deifned in IPC 7721 Procedure 3.2 Bow and Twist Repair "Bow and twist after soldering shall not exceed 1.5% for through hole PC boards and .75% for surface mount PC boards. The bow and twist shall not be sufficient to cause difficulties d
SMTnet Express January 31, 2013, Subscribers: 26152, Members: Companies: 9105, Users: 34242 Projection Moiré vs. Shadow Moiré for Warpage Measurement and Failure Analysis of Advanced Packages There are three key industry trends that are driving
SMTnet Express, July 6, 2017, Subscribers: 30,558, Companies: 10,626, Users: 23,470 Effects of Package Warpage on Head-in-Pillow Defect Zhenyu Zhao, Chuan Chen, Yuming Wang, Lei Liu, Guisheng Zou, Jian Cai and Qian Wang - Tsinghua University
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/leadfree.pdf
, °C ALLOY COMPOSITION, wt% PROPRIETARY AND CONFIDENTIAL INFORMATION Pages: 4 of 24 Rev Level: 1 Rev Date: 1/03/01 Eutectic Vs. Lead Free Process window comparison Conclusions
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