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Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Industry Directory | Manufacturer
NEW Thermally Managed, CTE controlled, Very Rigid, Light Weight STABLCOR PCB / Substrate Technology
Thermally Managed � Heat Dissipating PCB�s (Printed Circuit Boards) By STABLCOR Corporation STABLCOR TM Printed Circuit Board Material Product Information STABLCOR Corporation has developed a new printed circuit board technology that has the followin
STABLCOR� is a Thermally Managed PCB / Substrate material technology with many benefits: High Thermal Conductivity with a product family that ranges from 100 W/m K up to 1000 W/m K Can more closely match the CTE mismatch that is common today bet
Electronics Forum | Thu Oct 11 22:25:50 EDT 2001 | davef
Bruce I�m with yall. Designers and fabricators say �pins�. You say: * BGA pins are 1mm [0.039�] pitch. * BGA pads are 0.4mm [0.0157�] diameter. * BGA pins are 0.6 mm [0.024�] side-to-side. * Board thickness is ~0.4 mm [0.015�] First, as you can
Electronics Forum | Tue Jun 25 01:24:25 EDT 2019 | sssamw
That is possibley CTE mismatch between QFN and PCB material, the thicker PCB the higher fail rate.
Industry News | 2003-06-24 08:14:51.0
R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.
Industry News | 2019-07-25 07:53:37.0
The Trump administration today is recognizing IPC member Calumet Electronics in Calumet, Michigan, for its efforts to expand its skilled workforce.
Parts & Supplies | Circuit Board Assembly Products
1). FR-4 Tg170, Lead-free, Low Z-axis CTE, Low water absorption. 2). Excellent thermal stability and anti-CAF performance 3). 2-30 layer, 1.6mm thick 4). 1 oz copper finished 5). 10% impedance control 6). Immersion gold, HASL LF. 7). Suitable for hig
Technical Library | 2008-11-13 00:06:32.0
The electronics industry is facing issues with hot spots, solder joint stresses and Coefficient of Thermal Expansion (CTE) mismatch between PCB and IC substrate. Flip chip type packages for example have very low CTE compared to traditional PCB material. Thus it is necessary to have low CTE printed circuit boards in order to keep solder joint intact with such low CTE packages. There are currently several materials available in the market to address thermal and CTE challenges but each material has its own advantages and limitations...
Technical Library | 2008-02-04 12:13:38.0
Engineers are always striving to make a lighter, faster and stronger PCB. In order to achieve their designs, engineers must turn to alternative materials to enhance their designs. There are many materials that allow for thermal, coefficient of thermal expansion (CTE) and rigidity. Many times if a material enables an engineer to have CTE they will have to sacrifice thermal. Currently carbon composite laminates are being used in order to achieve an ideal PCB with thermal, CTE and rigidity with almost no weight premiums.
Meeting Heat And CTE Challenges Of PCBs And ICs News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Meeting Heat And CTE Challenges Of PCBs And ICs The electronics industry
Meeting Heat And CTE Challenges Of PCBs And ICs News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Meeting Heat And CTE Challenges Of PCBs And ICs The electronics industry
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/trimming-heels-under-the-component-body_topic12_post3020.html
Trimming heels under the component body - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns New Posts FAQ Search Events Register Login Trimming heels under the component body
| https://www.eptac.com/blog/the-journey-of-a-pcb-design-instructor
The Journey of a PCB Design Instructor Cherie Litson with EPTAC Looking for solder training standards, manuals, kits, and more
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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