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Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
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Legendary Military Workhorse with Proven Reliability, Longevity & Durability Utilized at all major US and International Military depots, you'll find the PRC 2000 at shipboard repair shops, mobile maintenance vans and thousands of intermediate mainte
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Eureka TUS-501 Fast Super Dryer Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/tus-501 Model: TUS-501 Fast Super Dryer Capacity: 372 Liters Humidity Range: 10%-50% Recovery Time: Recovers to ≤ 20% RH within 2 hours after accessing doo
Electronics Forum | Sat May 02 23:31:06 EDT 2009 | kareal
Thanks davef. The defect always occurred during UHAST reliability, but not find in reflow. The key is that there is tin diffuse to copper trace under solder mask. is it a "normal" board defect and what is the potential risk for device? thanks!
Electronics Forum | Wed Apr 01 04:34:41 EST 1998 | Alan Pestell
We are looking at reflow soldering some Flexi-rigid pcbs. I have heard that IR reflow soldering can make the Polyimide "self heat" and cause de-lamination. Does anyone have any info.
Industry News | 2018-10-18 10:23:07.0
Typical RoHS Issues in PCB Assembly
Industry News | 2015-11-25 16:58:05.0
On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.
Technical Library | 2024-07-24 01:04:35.0
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size, such as a near die size footprint, thin profile, and light weight; (2) easy PCB trace routing due to the use of perimeter I/O pads; (3) reduced lead inductance; and (4) good thermal and electrical performance due to the adoption of exposed copper die-pad technology. These features make the QFN an ideal choice for many new applications where size, weight, electrical, and thermal properties are important. However, adoption of QFN often runs into voiding issue at SMT assembly. Upon reflow, outgassing of solder paste flux at the large thermal pad has difficulty escaping and inevitably results in voiding. It is well known that the presence of voids will affect the mechanical properties of joints and deteriorate the strength, ductility, creep, and fatigue life. In addition, voids could also produce spot overheating, lessening the reliability of the joints.
Technical Library | 2014-06-12 16:40:19.0
Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.
WASET - World Academy of Science, Engineering and Technology
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
http://paceworldwide.com/products/conductive-rework-systems/prc-2000/prc-2000-pace-repair-center-the-benchtop The PRC 2000 Benchtop Factory is the ultimate rework center. The PRC 2000 can tackle just about any Thru-Hole, SMT application and is well
Effects of an Appropriate PCB Layout and Soldering Nozzle Design on Quality and Cost Structure in Selective Soldering Processes If you don't see images, please visit online version at: http://www.smtnet.com/express/ Effects
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Circuit Board Voids & PCB Delamination-News-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Home About I.C.T News Products Video Projects Service Join Us Contact Us Home About I.C.T
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” box Measles Delamination Crazing 4 Measles What are they? A separation of the epoxy from the fiberglass fiber bundles at the intersection of the warp and weft of the yarn fibers. 5 Measles 6 Measles 7 Measles 8 Delamination
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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