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Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
The more detail and video please check the link: www.pcb-separator.com This machine specialising the LED assembly industry. with the high precision and all with the CE certify.It use the Europe quality standard and different from our other
The more detail and video please check the link: www.pcb-separator.com This machine specialising the LED assembly industry. with the high precision and all with the CE certify.It can cut the board with the led chip no damage and no bend. W
Electronics Forum | Mon Feb 05 17:18:53 EST 2001 | davef
Wha, Nellie!!! Delamination & Blistering IPC-A-600D Although it may occasionally occur because of a severe process breakdown, delamination and blistering occurs as a result of an inherent weakness of the material. Either condition represents a brea
Electronics Forum | Sat May 02 08:48:32 EDT 2009 | davef
You have a board defect. Any moisture and/or organic contaminants trapped by the solder resist during lamination may cause solder mask delamination, blistering and/or adhesion loss during subsequent soldering operations or during extended use.
Industry News | 2003-04-02 09:03:49.0
Configural Recognition(TM) Object and Image-Analysis Technology Enables One-Hour Program Generation
Industry News | 2018-04-22 19:12:45.0
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Technical Library | 2014-06-12 16:40:19.0
Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.
WASET - World Academy of Science, Engineering and Technology
Technical Library | 2018-08-01 11:25:59.0
With complexities of PCB design scaling and manufacturing processes adopting to environmentally friendly practices raise challenges in ensuring structural quality of PCBs. This makes it essential to have a good 'Design for Test' (DFT) to ensure a robust structural test. (...)During the course of the DFT review, can we realize a good test strategy for the PCBA. How can the test strategy of the PCBA be partitioned as to what portions of the design can be covered structurally and what is covered functionally, in a way that provides best diagnostics to discover faults
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Career Center | , Pennsylvania USA | Engineering,Production,Quality Control,Research and Development
SKILLS Quote preparation for RFQ projects. Exposure to IPC A 610 and IPC A 600. Knowledge of Potential Failure Mode Effect Analysis (PFMEA), Process control plan (PCP) for new products, based on the Critical to Quality (CTQs). Knowledge in handli
Career Center | Thanjavur, India | Production,Quality Control,Technical Support
work in one year and above Quality engineer in sanmina,current work in SMT Technical engineer in coimbatore
SMTnet Express, June 12, 2014, Subscribers: 22834, Members: Companies: 13899, Users: 36331 Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow Arijit Roy; World Academy of Science, Engineering
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_09_16_09.pdf
Cracking or delamination during reflow tends to be an overstress mechanism and can therefore be described as a stress vs. strength phenomenon
| http://etasmt.com/cc?ID=te_news_bulletin,23574&url=_print
>> News Circuit Board Voids & PCB Delamination Circuit Board Voids Circuit Board Voids are cavities or air pockets inside the solder joint formed by gases that are released during reflow or by flux residues that fail to escape
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
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