Industry Directory | Consultant / Service Provider / Manufacturer
Designer & Manufacturer of Acoustic Microscopes for Nondestructive Component Inspection.
Industry Directory | Manufacturer
Custom Cable assembly, PCB Assembly/Rework, Debug and Failure Analysis, Cable loom wiring, Box build, Power Supply test and rework, Automotive, Instrumentation,Medical, Security
SMT Offline AOI Inspection Machine ZW 500 Dimension:900*1100*1350 mm PCB width:30x30-450x330mm Inspection Component: 0402 chip Weight:Aprox. 450kg Product description: SMT Offline AOI Inspection Machine ZW 500 INQUIRY SMT Offline
ZMD820 Standard Online AOI Inspection solution Feature ▶Flexible/multi-purpose AOI. ▶Vector analysis algorithm to achieve the best detection capability. ▶German brand 5 million pixel industrial camera. ▶The whole board is matched with multiple detec
Used SMT Equipment | X-Ray Inspection
Nordson DAGE XD7600NT Ruby X-Ray Inspection Machine Nordson DAGE XD7600NT Ruby X-Ray Inspection Machine Vintage: Year 2014 PCB Direction: Left to Right Condition: Refurbished, working Running Hours: Series Number:X215914 Missing Parts: No Warra
Used SMT Equipment | Soldering - Reflow
Overseas Agent wanted ! Features PC Control System Huge memory capacity or data storage with Windows program provide user friendly data analysis - Storage of entire year of production records and information , graphic analysis , machine tro
Industry News | 2003-05-28 08:28:54.0
For June 2-4 (Mon. - Wed.)Design Automation Conference 2003
Industry News | 2003-03-12 08:28:44.0
CAM350 Release 8 is aimed at allowing engineering and manufacturing groups to detect and fix potential PCB fabrication problems earlier in the process.
Technical Library | 2010-01-13 12:34:10.0
Micro-sectioning (sometimes referred to as cross-sectioning)is a technique, used to characterize materials or to perform a failure mode analysis, for exposing an internal section of a PCB or package. Destructive in nature, cross-sectioning requires encapsulation of the specimen in order to provide support, stability, and protection. Failures that can be investigated through micro-sectional analysis include component defects, thermo-mechanical failures, processing failures related to solder reflow, opens or shorts, voiding and raw material evaluations.
Technical Library | 2024-09-02 17:01:54.0
A printed circuit board (PCB) is an integral component of any electronic product and is among the most challenging components to recycle. While PCB manufacturing processes undergo generations of innovation and advancement with 21st century technologies, the recycling of PCBs primarily employs 1920's shredding and separation technologies. There is a critical need for alternative PCB recycling routes to satisfy the increasing environmental demands. Previous work has developed an environmentally benign supercritical fluid process that successfully delaminated the PCB substrates and separated the PCB layers. While this work was successful in delamination of the PCB substrates, further understanding is needed to maximize the interactions between the supercritical fluid and PCB for an optimal processing scenario. As such, this research presents an exploratory study to further investigate the supercritical fluid PCB recycling process by using supercritical carbon dioxide and an additional amount of water to delaminate PCB substrates. The focus of this study is to test delamination success at low temperature and pressure supercritical conditions in comparison to the previous studies. Furthermore, material characterization methods, such as differential scanning calorimetry, dynamic mechanical analysis, and Fourier transform infrared spectroscopy, are included to study the delaminating mechanisms. Results from the recycling process testing showed that the PCB substrates delaminated easily and could be further separated into copper foils, glass fibers and polymers. Surprisingly, the material characterization suggested that there were no significant changes in glass transition temperature, crosslink density, and FTIR spectra of the PCBs before and after the supercritical fluid process.
Bob Willis videos show you How to Do It each month. This month we talk about adhesion testing like copper foil, plated copper on PCBs or conformal coating adhesion to board assemblies. Adhesion testing can be used for many different materials and in
ZESTRON proudly offers SIR testing at our Manassas, VA location. SIR is a quantitative test method used to characterize the PCB manufacturing process residues and their impact on reliability. ZESTRON’s SIR testing capability is offered to clients who
Events Calendar | Tue Apr 20 18:30:00 UTC 2021 - Tue Apr 20 18:30:00 UTC 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Career Center | , La Massana China | Engineering
Process Engineering Manager The manager is responsible all aspects of process engineering functions such as process automation, process improvements, trouble shoot and conduct failure analysis on all processes and providing engineering support to all
Career Center | Tustin, California USA | Engineering
REI is seeking a bi-lingual (English/Japanese) surface mount technology (SMT) Manufacturing Engineer with printed circuit board (PCB) design and manufacturing experience to join our California Operations Group. The SMT Manufacturing Engineer will de
Career Center | Shanghai, China | Engineering,Research and Development,Technical Support
Lead the operation and activity of UIC SMT Lab in China site. Operations include the following: 1. Prototyping of electronic and semiconductor packaging �� Flip chip prototyping, Pin-in-Paste prototyping, Pb-free process assembly 2. Failure analysis
Career Center | KANPUR, UTTAR PRADESH India | Engineering,Management,Production
1)Responsible for Implementation of Process Control of SMT /Thru hole components assembly consisting of packages like BGA,MICRO BGA,QFP,PLCC and similar packages on the PCB�s/hybrids, wave soldering as well as reflow soldering processes., Testing of
| https://unisoft-cim.com/cells_faq.htm
. How can I do this? Once your work-in-progress, failure/quality or other data is in the CELLS WORKFLOW database, you can report against it with CELLS WORKFLOW or any report writer or analysis tool that supports ODBC (Crystal Reports, Access, SAS, Excel
Imagineering, Inc. | https://www.pcbnet.com/blog/the-role-of-pcb-assembly-in-the-internet-of-things-iot/
The Role of PCB Assembly in the Internet of Things (IoT) Skip to main content Resources Support Contact Us FAQs Live Chat My Account 847-806-0003 Menu PCB Capabilities Fabrication Technology Roadmap Materials Available HDI Tolerances Certifications
