Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74 x 74mm Services include: PCB layout and
Electronics Forum | Fri Jul 24 13:45:12 EDT 1998 | Bob Willis
Yes you need solder paste for BGA. Have a look at the Free BGA documents on my home page which you can download. They cover design, rework, and general assembly www.bobwillis.co.uk | My firm has just begun it's first PCB that will use BGA packaging.
Electronics Forum | Fri Sep 05 06:17:36 EDT 2014 | edriansyah
Hi, We have a problem with our BGA Pad. Our PWB manufacturer make the BGA Pad in irregular form. some big, some small. Please see the picture on attachment. BGA Detail BGA Pitch 0.5 mm BGA Ball 0.3 mm BGA Pad (big) 0.2 mm (as per gerber) BGA
Industry News | 2011-11-20 13:36:13.0
GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform
Industry News | 2015-10-21 17:54:32.0
Count On Tools will display its new QWIKTRAY system in the AdoptSMT Booth, Hall A3 Booth 181, at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. The QWIKTRAY platform allows surface mount components to be picked up in a repeatable method when tape-and-reel is not available and standard JEDEC trays do not exists. As a result, customers no longer have to place these components by hand.
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
In this video we briefly demonstrate the removal of a BGA component from a smart phone circuit board. To get a quote or obtain more information on the IR 1000, visit the link below: https://www.paceworldwide.com/products/area-array-bga-rework/bga-r
| pcb-services-inc.com&gigaurl=https://precision-pcb-services-inc.com/collections/bga-rework-stations/products/model-rw-sv2000a-bga-rework-station" target="_blank">https://precision-pcb-services-inc.com/collections/bga-rework-stations/products/model-rw-sv2000a-bga-rework-station
) Technical specification: Applicable PCB Max. PCB size 1000X800mm = 39”X 31.5” Workable area 800X1000mm Bottom preheat area 700*600mm = 27.5”X23.5” PCB thickness 0.5-5mm (Max. thickness 10mm with custom-made jig
| https://www.eptac.com/faqs/ask-helena-leo/ask/problems-with-pcb-micro-voiding
Problems With PCB Micro Voiding - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
