Electronics Forum | Sun Oct 09 11:16:06 EDT 2016 | mekmat
Hello, I would like to ask you about the minimal distance between components and border of pcb especially V-cut to avoid crack of component during depaneling? I need some standard (IPC or something) where is this defined? Thank you for your support
Electronics Forum | Mon Mar 13 15:10:52 EST 2000 | Stuart Adams
Assuming agressive design rules what is the minimum distance I can get away with between the board edge and a SMT pad and between the board edge and a plated mounting hole ??? (The board is only 1"x2" and the mounting holes are 80 mil dia, 125 mil
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Industry News | 2022-12-14 12:21:04.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1841 at the 2023 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Jan. 24-26, 2023, at the San Diego Convention Center in California.
Industry News | 2023-04-11 09:52:04.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems at SMTconnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany. The company will showcase a total of five (5) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the electronics manufacturing industry in Hall 4A, Stand 128.
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work by using a vacuum pick-and-place mechanism to pick up components from a feeder and place them in the correct holes on the PCB
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