InspectScan VPI is a fully integrated, stand-alone process control, measurement and inspection and programming workstation for use in setting up processes before the production floor in the PCB or Hybrid Microcircuit assembly industries. InspectScan
New Equipment | Solder Paste Stencils
Full automation solder paste screen stencil printers for led tube light PCB solutions CL-1200,1500 Ideal for LED strip production. CL1200 provides fast, high-precision printing LED panels and other applications. Fully automatic production transpo
Electronics Forum | Fri Aug 19 01:56:53 EDT 2011 | ppcbs
I've been seeing a lot of product come in with what appears to be black pad lately. I've sent stuff out to labs to be told there is no contamination. Contamination or not solder won't wet to it. Regardless of what it is we have a method to remove
Electronics Forum | Thu Sep 10 15:06:11 EDT 2009 | dyoungquist
My guess is that he is talking about the gold plated pads not fully wetting with solder. We have seen this on some of our ENIG boards with the gold still showing at the far corners of the rectangular pads. Not knowing if this is hand soldering or p
Industry News | 2018-10-18 11:19:07.0
How To Design Cost-Effective PCBs
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Parts & Supplies | SMT Equipment
contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 40000411 Y-AXIS SENSOR BR ASSY 40000413 FEEDER FLOAT_SENS ASSY 40000414 FEEDER_SENS ASSY 40000875 WAIT_SENSOR_BRACKET 40000908 IN SENSOR ASM 40000912 SENSOR ADJUST SPRIG 4000
JPG_副本1.jpg)
Parts & Supplies | SMT Equipment
contact person:banny chen mail:zksale@hysmt.cn skype:miayuan8 40000411 Y-AXIS SENSOR BR ASSY 40000413 FEEDER FLOAT_SENS ASSY 40000414 FEEDER_SENS ASSY 40000875 WAIT_SENSOR_BRACKET 40000908 IN SENSOR ASM 40000912 SENSOR ADJUST SPRIG 4000
Technical Library | 2007-08-16 13:34:31.0
While experienced inspectors may be able to determine the aesthetic differences between a lead-free PCB assembly and a tin-lead version, one cannot rely on the "experienced eye". "Less wetting out to the pad edges" (Figure A) and "graininess and lack of shininess of the solder joint" (Figure B) are typical comments about some lead-free solder joints. However, in cases where a Nitrogen atmosphere was present during the reflow of the solder joint (Figure C), there will be little visual differences between the lead free alloys and their tin-lead counterparts.
Technical Library | 2020-07-29 19:58:48.0
The majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on Polyester (Al-PET) substrates. This material is gaining popularity and has found wide use in RFID tags, low cost LED lighting and other single-layer circuits. However, both aluminum and PET have their own constraints and require special processing to make finished circuits. Aluminum is not easy to solder components to at low temperatures and PET cannot withstand high temperatures. Soldering to these materials requires either an additional surface treatment or the use of conductive epoxy to attach components. Surface treatment of aluminum includes the likes of Electroless Nickel Immersion Gold plating (ENIG), which is extensive wet-chemistry and cost-prohibitive for mass adoption. Conductive adhesives, including Anisotropic Conductive Paste (ACP), are another alternate to soldering components. These result in component substrate interfaces that are inferior to conventional solders in terms of performance and reliability. An advanced surface treatment technology will be presented that addresses all these constraints. Once applied on Aluminum surfaces using conventional printing techniques such as screen, stencil, etc., it is cured thermally in a convection oven at low temperatures. This surface treatment is non-conductive. To attach a component, a solder bump on the component or solder printed on the treated pad is needed before placing the component. The Aluminum circuit will pass through a reflow oven, as is commonly done in PCB manufacturing. This allows for the formation of a true metal to metal bond between the solder and the aluminum on the pads. This process paves the way for large scale, low cost manufacturing of Al-PET circuits. We will also discuss details of the process used to make functional aluminum circuits, study the resultant solder-aluminum bond, shear results and SEM/ EDS analysis.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
---> SMT Express, Volume 3, Issue No. 6 - from SMTnet.com Volume 3, Issue No. 6 Friday, June 15, 2001 Featured Article Return to Front Page PCB Assembly Techniques by Harvey Twyman , University of Kent at Canterbury "I'm sure you
ATTENDANT WET CHEMICAL PROCESSES) Hole wall preparatio
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
-Computed Tomography Multiphysics Modeling Substrates and Finishes Thermal Management Tin Whiskers PCB Technology: Bio-Compatible Substrates Black Pad and Surface Finish Defects Conductive Anodic Filament (CAF
| http://pcbasupplies.com/thermaltronics-tmt-tc-2-lead-free-tip-tinner-20g/
Thermaltronics TMT-TC-2 Login Create Account Contact View My Cart Menu × Categories Hand Soldering & Rework Automation Tooling PCB Support Systems Soldering Robots Material Handling Dry Storage Cabinets Component Handling Selective Solder Nozzles Pick
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
