Electronics Forum | Mon Sep 06 04:42:18 EDT 2004 | KenF
Thx for the replies. Acutally I am doing a process related study to see whether the process (pcb depanelling)can induce crack to an MLCC. After depanelling, I will do a thermal shock on the MLCC based on IEC 384-1, that is, five cycles of 30min at hi
Electronics Forum | Wed Feb 05 05:29:33 EST 2003 | Rajinder Sharma
If you are facing problem of craked capacitor only after breaking of the panel into individual PCB's, this may be due to stress being generated on the capacitors terminals. The stress may be due excess pressure being applied on the panel for breaking
Features: For the automatic pcb cutting equipment developed for the COB light source board, the microcomputer is used to control the automatic feeding board. Suitable for PCB board, aluminum substrate, copper board slitting. Widely used in auto
Use of Non Etching Adhesion Promoters in Advanced PCB Applications If you don't see images, visit online version: http://www.smtnet.com/express/ Use of Non Etching Adhesion Promoters in Advanced PCB Applications Based on tests carried
Failure due to board flex cracks persists as the do
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
.gif)
.gif)
winsouce.jpg)