Layer: 2L Base Material:CEM-3 CTI300 Board Thickness: 1.6mm Final copper: 35um Surface Finish: Immersion Tin/Sn Solder mask: Green Silkscreen: white Profile: Routing + v-cut E-test: 100% Fixture Quality report: Solderability test, F
Specification: 8L(1+6+1) Material: FR-4 Board thickness: 1.0mm Final copper: 18um Solder mask color: Green Silkscreen: White Surface Finish: Immersion Gold Profile: Routing and stamp holes E-test: 100% Fixture Quality report: Solder
Electronics Forum | Tue Apr 27 13:41:16 EDT 1999 | Scott McKee
| i am trying to design a stencil fixture for manual printing. has anyone done this before or has an idea? thanks | There are sooo many variables; product size, 1 vs. 2 sided boards, support, component size, pitch, stencil alignment, PCB thickness,
Electronics Forum | Mon Jul 01 09:33:08 EDT 2019 | dbuschel
if you can't change the PCB materials or design at this point, you might be able to reduce it somewhat through the use of fixtures or edge stiffeners. Unless it is a particularly thick board, I don't think the reflow profile would be the issue. The t
Used SMT Equipment | SPI / Solder Paste Inspection
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Panasonic AM100 pick and place machine FEATURES ▶Single head (single beam) capable of placing an impressive component array including: 0402mm to 120x90x28mm▶Capable of placing large connectors, odd-shaped components, and advanced packaging types suc
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In the fast-paced world of electronics manufacturing, achieving precision and efficiency is paramount. The LCO-350 PCB Laser Depanelizer stands as a revolutionary solution, pushing the boundaries of PCB (Printed Circuit Board) cutting technology.
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Many customers and electronic designers were asking questions about the aluminum-based board, today our chief technical official Luca Zhang shared the knowledge and experience to you.
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SMTnet Express, July 6, 2017, Subscribers: 30,558, Companies: 10,626, Users: 23,470 Effects of Package Warpage on Head-in-Pillow Defect Zhenyu Zhao, Chuan Chen, Yuming Wang, Lei Liu, Guisheng Zou, Jian Cai and Qian Wang - Tsinghua University
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LED panels and other applications. Fully automatic production transports the board from the loader, automatically aligns the PCB to the stencil, lowers the stencil, and prints solder paste onto the pads at a programmable speed and pressure
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. Unfortunately, it is all too common, and one of the biggest headaches for PCB designers, fabricators, and manufacturers across the globe. When a printed circuit board experiences warpage, it no longer retains a flat profile, typically curling at the ends
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