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Base Material: FR4 Layer count: 4 layer Board thickness: 1.6mm Copper Thickness:1 oz Surface finish: nickel gold plating Soldermask Colors: Green Size:159.25*182/1up
8-layer PCB with impedance control. Surface Finish: Immersion Gold
Electronics Forum | Fri Mar 19 16:56:42 EDT 2010 | cisridn
Both the coin and the device flange that is soldered to the coin have a gold finish. A solder preform is placed in the pocket of the coin before the device is placed prior to reflow. Solder adhere's to both surfaces
Electronics Forum | Sat Oct 24 13:03:20 EDT 2015 | mikekeens
With regards to PCB surface finish I would recommend Electroless Nickel Immersion Gold (ENIG) because of the long shelf life, tarnish resistance, RoHS-compliance, and easy soldering compared to other surface finishes. http://www.surfacemountprocess.
Industry News | 2011-11-20 13:36:13.0
GPD Global has been awarded two Global Technology Awards in the categories of Adhesives/Coatings/Encapsulants and Dispensing Equipment for its PCD Dispensing on the MAX Series Platform
Industry News | 2018-10-18 09:29:21.0
Wave soldering welding interview direct contact with high temperature liquid in the production
Technical Library | 2018-07-11 22:46:13.0
For a demanding automotive electronics assembly, a highly thermal fatigue resistant solder alloy is required, which makes the lead-free Sn-Ag-Cu type solder alloy unusable. Sn-Ag-Bi-In solder alloy is considered as a high reliability solder alloy due to significant improvement in thermal fatigue resistance as compared to a standard Sn-Ag-Cu alloy. The alloy has not only good thermal fatigue properties but it also has superior ductility and tensile strength by appropriate addition of In; however, initial results indicated a sub-par performance in joint reliability when it is soldered on a printed circuit board (PCB) with Electroless Nickel Immersion Gold (ENIG) surface finish. Numerous experiments were performed to find out appropriate alloying element which would help improve the performance on ENIG PCBs. Sn-Ag-Bi-In solder alloys with and without Cu additions were prepared and then tests were carried out to see the performance in a thermal fatigue test and a drop resistance test.to investigate the impact of Cu addition towards the improvement of joint reliability on ENIG finish PCB. Also, the mechanism of such improvement is documented.
Two stations, one for soldring and the another is for goods loading at the same time. So it doubled the production efficiency
SMTnet Express April 25, 2013, Subscribers: 26322, Members: Companies: 13358, Users: 34615 Determination of Copper Foil Surface Roughness from Micro-section Photographs by: Scott Hinaga, Soumya De, Aleksandr Y. Gafarov, Marina Y. Koledintseva
| pcb-services-inc.com&gigaurl=https://precision-pcb-services-inc.com/products/bga-rework-training" target="_blank">https://precision-pcb-services-inc.com/products/bga-rework-training
to the Lead Free Process. Identify and resolve defect anomalies related to Surface Finish, i.e.. "Black Pad". And Much more! Price for this 2-day class at our Texas facility is $1,800.00 per student
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_how-to-make-hybrid-qfn-with-multiple-thermal-pads_topic1947.xml
PCB Libraries Forum : How To Make Hybrid QFN with Multiple Thermal Pads? PCB Libraries Forum : How To Make Hybrid QFN with Multiple Thermal Pads
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