Electronics Forum | Mon Oct 14 18:27:38 EDT 2002 | kennyg
In regards to baking an assembly prior to hot air (BGA) rework.... 1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-br
Electronics Forum | Tue Oct 15 10:12:44 EDT 2002 | davef
1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-brainer. Sometimes, based on the proximity of the MS components. >2)
? In other words when the insulation is installed on the wire and then it is soldered to a terminal. Read Answer Ceramic CCA’s and Aqueous Wash and Bake Out Prior to Parylene Coating Question
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, and reliability goals. Manufacturing support starts with a partnership between your company and your supply chain. Early collaboration ensures that all expectations and requirements are established at the beginning of the development phase, prior to
