Industry Directory: pci card issue (13)

BVM Limited

Industry Directory |

CompactPCI, (CPCI) PCI Mezzanine Cards (PMC Modules), VMEbus and IndustryPack Manufacturer and Integrator.

Conduant Corporation

Industry Directory |

Manufactures the only card to card real-time storage systems for the PCI/CPCI busses at 100 Mbytes/Sec

New SMT Equipment: pci card issue (135)

PCI LVDS 8T

PCI LVDS 8T

New Equipment |  

The PCI-LVDS-8T PCI card has 8 channels of LVDS output (8T), digital filtering and storage. The PCI-LVDS-8T is compatible with TIA/EIA-644 LVDS standards. The card features "Scatter gather" DMA data transfer by Dynamic Engineering.

Dynamic Engineering

COMM+4.PCI

COMM+4.PCI

New Equipment |  

PCI 4 Port RS-232/422/485 Card

Sealevel Systems, Inc.

Electronics Forum: pci card issue (207)

Reflow soldering issue

Electronics Forum | Tue Sep 04 14:02:35 EDT 2018 | elsabudz

Hi Peter, I read your concerns regarding IC parts not packaged with desiccants and thought you may find our new Type 2 Humidity Indicator card of interest. Please visit https://www.clariant.com/type-2-humidity-indicator-card Thanks, Elsa

DEK 265Lt vision issue

Electronics Forum | Wed Feb 14 08:48:57 EST 2024 | andrii

hi, I have very very old DEK 265 Lt And I have a problem that Mr. processman described a long time ago. But no one answered him. Maybe someone can help me now? "We have a strange issue with a DEK 265 Lt, it powers up and initialises fine. Camera LE

Used SMT Equipment: pci card issue (10)

Agilent 16903A

Agilent 16903A

Used SMT Equipment | In-Circuit Testers

Agilent 16903A Logic Analysis System The Agilent 16903A logic analysis system provides high-performance, system-level debugging of digital designs. Expandability is the key to the system´s long-term value. Customize this system for your specifi

Test Equipment Connection

Agilent 16903A

Agilent 16903A

Used SMT Equipment | General Purpose Test & Measurement

Agilent-Keysight 16903A Logic Analysis System The Agilent 16903A logic analysis system provides high-performance, system-level debugging of digital designs. Expandability is the key to the system´s long-term value. Customize this system for you

Test Equipment Connection

Industry News: pci card issue (161)

AsusTeK Selects Cadence SPECCTRAQuest For High-Speed PCB System Development

Industry News | 2003-05-21 09:03:19.0

Cadence Design and Analysis Solution Used for Asus's Ultra-high-frequency PCB Designs

SMTnet

SMTA Capital Chapter Tutorial – Supporting High Reliability at the OEM: A PCB Perspective

Industry News | 2019-03-03 18:51:58.0

The SMTA Capital Chapter and UP Media Group/Circuits Assembly Magazine are pleased to co-sponsor this Chapter Tutorial Program on March 28 featuring presentations by Yaad Eliya and Jim Barry of PCB Technologies.

Surface Mount Technology Association (SMTA)

Parts & Supplies: pci card issue (82)

Technical Library: pci card issue (2)

Solutions for Selective Soldering of High Thermal Mass and Fine-Pitch Components

Technical Library | 2020-05-07 03:46:27.0

The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.

SELECT Products | Nordson Electronics Solutions

Techniques for Selective Soldering High Thermal Mass and Fine-Pitch Components

Technical Library | 2022-08-08 15:06:06.0

Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.

Hentec Industries, Inc. (RPS Automation)

Videos: pci card issue (64)

Siemens SMT SPARE PARTS PROXIMITY SWITCH LIMIT Y-AXIS 00300601-05

Videos

03051369-01 Middle cover 1-prt comp corrug. 2-gantry    03051467-01 Piping of nozzle station / with valve    03051521-01 COVER PLATE Y-MAGNETIC GUIDE X4i    03051561-01 Video multiplexer    03051596S01 trailing-cable unit SIPLACE X4i 2P G    030

Qinyi Electronics Co.,Ltd

Siemens SMT SPARE PARTS SIEMENS VACCM DISTRIBUTOR COMPLETE 03003261S01

Videos

03056628S01 6-segm. star compl. DLM3    03056683-01 spring 1.8x10.2x62.7  (D-234B) (black)    03057320-01 Nozzle type 905 cpl. ESD / 1x0,15    03057572S01 Axis Unit A364    03057620-01 Components Table Lock 1/3    03057703-01 HOLDER SICK BC-READ

Qinyi Electronics Co.,Ltd

Events Calendar: pci card issue (1)

Solder Paste Qualification Testing - SMTA Webinar

Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,

Solder Paste Qualification Testing - SMTA Webinar

Surface Mount Technology Association (SMTA)

Career Center - Jobs: pci card issue (26)

Manufacturing Test Engineer

Career Center | Fremont, California USA | Engineering

Ensure manufacturing have calibration and preventive maintenance processes in place to ensure the integrity of test equipment used on our products. Lead and responsible for all aspects of the RMA/GRS processes from initial analysis, board debug t

Unigen Corporation

Validation Test Engineer

Career Center | Fremont, California USA | Engineering

Define validation test plan for SSD’s and other Flash products. Implement a test plan strategy and to develop test methodologies to cover product specification for SSD’s and other Flash products. Assist in selection of test hardware and writi

Unigen Corporation

Career Center - Resumes: pci card issue (21)

Electronics Manufacturing /SMT/Quality/ISO/6 sigma

Career Center | , | 2013-03-07 05:50:27.0

Looking for Leader ship Opprtunity in Electronics Manufacturing Plant in India

Asst.Manager Manufacturing &QC

Career Center | Bangalore, India | Engineering,Management,Production,Quality Control,Technical Support

WORK EXPERIENCE DETAILS: 7+ Years of Experience in manufacturing & hardware testing of Protocol conveter & Commissioning, Products delivery and QA/QC. 2+ Years of Experience in Hardware testing and Package Level testing. 2+ Years of Experience in

Express Newsletter: pci card issue (637)

Partner Websites: pci card issue (178)

How To Name Card-Edge Connector Footprints? - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2602&OB=ASC.html

How To Name Card-Edge Connector Footprints? - PCB Libraries Forum   Forum Home > Libraries > Footprints / Land Patterns    New Posts    FAQ    Search    Events    Register    Login How To Name Card-Edge Connector Footprints

PCB Libraries, Inc.


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