CompactPCI, (CPCI) PCI Mezzanine Cards (PMC Modules), VMEbus and IndustryPack Manufacturer and Integrator.
Manufactures the only card to card real-time storage systems for the PCI/CPCI busses at 100 Mbytes/Sec
The PCI-LVDS-8T PCI card has 8 channels of LVDS output (8T), digital filtering and storage. The PCI-LVDS-8T is compatible with TIA/EIA-644 LVDS standards. The card features "Scatter gather" DMA data transfer by Dynamic Engineering.
Electronics Forum | Tue Sep 04 14:02:35 EDT 2018 | elsabudz
Hi Peter, I read your concerns regarding IC parts not packaged with desiccants and thought you may find our new Type 2 Humidity Indicator card of interest. Please visit https://www.clariant.com/type-2-humidity-indicator-card Thanks, Elsa
Electronics Forum | Wed Feb 14 08:48:57 EST 2024 | andrii
hi, I have very very old DEK 265 Lt And I have a problem that Mr. processman described a long time ago. But no one answered him. Maybe someone can help me now? "We have a strange issue with a DEK 265 Lt, it powers up and initialises fine. Camera LE
Used SMT Equipment | In-Circuit Testers
Agilent 16903A Logic Analysis System The Agilent 16903A logic analysis system provides high-performance, system-level debugging of digital designs. Expandability is the key to the system´s long-term value. Customize this system for your specifi
Used SMT Equipment | General Purpose Test & Measurement
Agilent-Keysight 16903A Logic Analysis System The Agilent 16903A logic analysis system provides high-performance, system-level debugging of digital designs. Expandability is the key to the system´s long-term value. Customize this system for you
Industry News | 2003-05-21 09:03:19.0
Cadence Design and Analysis Solution Used for Asus's Ultra-high-frequency PCB Designs
Industry News | 2011-11-03 21:52:00.0
By davef: I was fortunate to be able to attend the SMTAI Exhibition Oct. 18-19, 2011. While I was walking around looking at the booths and talking to the exhibitors, I got this idea that I would report back on things that I found interesting. You know spread the news, since not everyone was there.
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
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Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Career Center | Fremont, California USA | Engineering
Ensure manufacturing have calibration and preventive maintenance processes in place to ensure the integrity of test equipment used on our products. Lead and responsible for all aspects of the RMA/GRS processes from initial analysis, board debug t
Career Center | Fremont, California USA | Engineering
Define validation test plan for SSD’s and other Flash products. Implement a test plan strategy and to develop test methodologies to cover product specification for SSD’s and other Flash products. Assist in selection of test hardware and writi
Career Center | , | 2013-03-07 05:50:27.0
Looking for Leader ship Opprtunity in Electronics Manufacturing Plant in India
Career Center | Bangalore, India | Engineering,Management,Production,Quality Control,Technical Support
WORK EXPERIENCE DETAILS: 7+ Years of Experience in manufacturing & hardware testing of Protocol conveter & Commissioning, Products delivery and QA/QC. 2+ Years of Experience in Hardware testing and Package Level testing. 2+ Years of Experience in
KingFei SMT Tech | http://www.smtspare-parts.com/sale-13366896-pmc-4b-pci-8p0027a-autonics-aska-board-4-axis-pc-pci-card-programmable-motion-controllers.html
PMC-4B-PCI 8P0027A Autonics Aska Board 4 Axis PC-PCI Card Programmable Motion Controllers Leave a Message We will call you back soon
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2602&OB=ASC.html
How To Name Card-Edge Connector Footprints? - PCB Libraries Forum Forum Home > Libraries > Footprints / Land Patterns New Posts FAQ Search Events Register Login How To Name Card-Edge Connector Footprints
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