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750 million cycles. The actuator is fully programmable in position, velocity and force wiht ‘Soft-Land’ capability. Dimensions [mm] 44 x 100 x 31 Stroke [mm] 10 +1/-0 Acceleration [G] 35 Peak Force [N] 38@6A (48VDC) SMAC’s Pate
Lite Fast A-1175 is a black, medical grade adhesive that cures within seconds after application of Ultraviolet light. Lite Fast A-1175 meets USP Class VI testing with extraction at 37�aC for 72 hours. Independent laboratories that are AALAC accredi
Electronics Forum | Fri Jan 04 09:44:59 EST 2008 | philkaz
Hello, I am Philip Kazmierowicz and I work with KIC, a Thermal Profiling company. We have done many lifetime experiments on Printed Circuit Boards over the years. The key thing to understand is that if the primary material of the board in FR4 fiber
Electronics Forum | Thu Jun 08 20:07:32 EDT 2023 | daniel_stanphill
The answer to this lies within the datasheets of the components on the board. Each component has its own specs as far as number of heat cycles, time at reflow, peak temperature, whether it can be washed, etc. You do not need to be as thorough on th
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight 8990A Agilent/HP 8990A 20 MHz to 40 GHz, Peak Power Analyzer The HP / Agilent 8990A provides complete and accurate characterization of complex pulsed signals. The 8990A performs seven automatic timing measurements (rise time, f
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight 8990A Agilent/HP 8990A 20 MHz to 40 GHz, Peak Power Analyzer The HP / Agilent 8990A provides complete and accurate characterization of complex pulsed signals. The 8990A performs seven automatic timing measurements (rise time, f
Industry News | 2003-03-19 08:25:45.0
Pilot Program Facilitates Information Exchange Standards in Electronics Manufacturing Industry
Industry News | 2019-03-03 18:43:44.0
IPC — Association Connecting Electronics Industries® announced today the January 2019 findings from its North American Printed Circuit Board (PCB) Statistical Program. Sales and orders both dropped sharply in January, but the book-to-bill ratio strengthened to 1.06.
Technical Library | 2009-04-30 18:06:24.0
This presentation surveys the most significant via and via-related laminate failure mechanisms from past to present using data from current induced thermal cycling (CITC) testing, failure analysis, and other sources. The relative life and failure modes of thru vias, buried vias, and microvias (stacked vs. non-stacked) are compared, along with the affect of structure, materials, and peak temperatures on the above. The origin of via-induced laminate failures such as "eyebrow cracks" and Pb free related internal delamination is also explored.
Technical Library | 2020-10-27 02:07:31.0
For companies that choose to take the Pb-free exemption under the European Union's RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products, there is a growing concern about the lack of Sn-Pb ball grid array (BGA) components. Many companies are compelled to use the Pb-free Sn-Ag-Cu (SAC) BGA components in a Sn-Pb process, for which the assembly process and solder joint reliability have not yet been fully characterized. A careful experimental investigation was undertaken to evaluate the reliability of solder joints of SAC BGA components formed using Sn-Pb solder paste. This evaluation specifically looked at the impact of package size, solder ball volume, printed circuit board (PCB) surface finish, time above liquidus and peak temperature on reliability. Four different BGA package sizes (ranging from 8 to 45 mm2) were selected with ball-to-ball pitch size ranging from 0.5mm to 1.27mm. Two different PCB finishes were used: electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) on copper. Four different profiles were developed with the maximum peak temperatures of 210oC and 215oC and time above liquidus ranging from 60 to 120 seconds using Sn-Pb paste. One profile was generated for a lead-free control. A total of 60 boards were assembled. Some of the boards were subjected to an as assembled analysis while others were subjected to an accelerated thermal cycling (ATC) test in the temperature range of -40oC to 125oC for a maximum of 3500 cycles in accordance with IPC 9701A standard. Weibull plots were created and failure analysis performed. Analysis of as-assembled solder joints revealed that for a time above liquidus of 120 seconds and below, the degree of mixing between the BGA SAC ball alloy and the Sn-Pb solder paste was less than 100 percent for packages with a ball pitch of 0.8mm or greater. Depending on package size, the peak reflow temperature was observed to have a significant impact on the solder joint microstructural homogeneity. The influence of reflow process parameters on solder joint reliability was clearly manifested in the Weibull plots. This paper provides a discussion of the impact of various profiles' characteristics on the extent of mixing between SAC and Sn-Pb solder alloys and the associated thermal cyclic fatigue performance.
8 KW, 20 KW typical Common Mode Range -100 VDC to +100 VDC peak-to-peak Normal Mode Range 1.5 V to 200 V peak-to-peak Overrange Protection ±150 VDC, continuous Hysteresis 150 millivolts, typical Wave Shape Sine, square, pulse, etc. Duty Cycle 10% to
8 KW, 20 KW typical Common Mode Range -100 VDC to +100 VDC peak-to-peak Normal Mode Range 1.5 V to 200 V peak-to-peak Overrange Protection ±150 VDC, continuous Hysteresis 150 millivolts, typical Wave Shape Sine, square, pulse, etc. Duty Cycle 10% to
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/adhesive-dispensing-systems-products/e-400-electric-guns
. With cycle rates below 6 milliseconds, E-400 guns accommodate a wide range of viscosities and provide superior repeatability for greater bead pattern control and consistency
KingFei SMT Tech | http://www.smtspare-parts.com/sale-11789719-k9f4g08u0d-sib0-samsung-chip-component-assembled-smt-machine-parts.html
: Samsung 4, Condition: Original New 5, Origin: Korean Manufacturer Part Number: K9F4G08U0D-SIB0000 Rohs Code: Yes Part Life Cycle Code
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