Industry Directory | Manufacturer
Overtop provide you SMD taping machine and Peel force tester with low cost, high quality and best ervice
Industry Directory | Manufacturer
Professional in turnkey PCBA service for PCB manufacture, PCB assembly and components sourcing. PCB passed ISO, TS16949, UL, CE and RoHS. PCBA compliant ISO9001 and IPC-A-610E. And components are all new & original.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
Electronics Forum | Thu Mar 09 17:48:17 EST 2006 | Chris
V-tek makes the PT-45 tester. http://www.vtekusa.com
Electronics Forum | Thu Mar 09 12:31:46 EST 2006 | jsloot
I am experiencing peel back problems when a particular component is used on a Meridian 1010 and 1020P machine. I would like to start testing this force but I need some more info. Besides GPD who else makes a tester? What industry standards can I refe
Used SMT Equipment | Semiconductor & Solar
Bondtester by DAGE, in good condition. DAGE Series 4000 Bondtester product information. The 4000 bondtester is multipurpose, capable of performing all pull and shear applications. The 4000 bondtester can be configured as a simple bond wire pull
Industry News | 2016-02-27 22:07:08.0
GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.
Industry News | 2013-03-12 11:34:11.0
GPD Global has appointed Technical Resources Corporation (TRC) as its representative in Florida, Puerto Rico and the Caribbean.
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Parts & Supplies | Pick and Place/Feeders
KHW-M9129-00 BELT2,CONVEYOR GREEN KHW-M9129-00 BELT2,CONVEYOR GREEN Other Yamaha parts we have in stock: KHJ-MC201-00 BODY,FEEDER KHJ-MC202-00 COVER,FEEDER SIDE KHJ-MC20C-00 SEAL,MAIN LABEL KHJ-MC10E-00 SCREW,FLAT HEXLOBE KH
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Parts & Supplies | Pick and Place/Feeders
90990-14J001 CIRCLIP (E) Other Yamaha parts we have in stock: KHJ-MC201-00 BODY,FEEDER KHJ-MC202-00 COVER,FEEDER SIDE KHJ-MC20C-00 SEAL,MAIN LABEL KHJ-MC10E-00 SCREW,FLAT HEXLOBE KHJ-MC210-00 MOTOR, FEED KHJ-MC134-00 GE
Technical Library | 2018-04-18 23:55:01.0
Higher functionality, higher performance and higher reliability with smaller real estate are the mantras of any electronic device and the future guarantees more of the same. In order to achieve the requirements of these devices, designs must incorporate fine line and via pitch while maintain good circuitry adhesion at a smooth plating-resin interface to improve signal integrity. The Semi-Additive Process (SAP) is a production-proven method used on low dielectric loss tangent (Df) build-up materials that enables the manufacture of ultra-fine circuitry. (...) This paper will discuss a new SAP process for low loss build-up materials with low desmear roughness (Ra= 40-100 nm) and excellent adhesion (610-680 gf/cm) at various processing conditions. Along with the process flow, the current work will also present results and a discussion regarding characterization on the morphology and composition of resin and/or metal plating surfaces using scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX), surface roughness analysis, plating-resin adhesion evaluation from 90o peel tests
Technical Library | 2024-09-02 18:48:58.0
The conversion to higher temperature "Lead Free" assembly reflow conditions has created an increased awareness that entrapped or absorbed moisture is a frequent root cause of thermally induced delamination at assembly reflow. There are two connected failure modes from entrapped moisture; incomplete resin cross-linking resulting in premature resin decomposition and also severe Z axis expansion from "explosive vaporization of the entrapped moisture at elevated temperatures at assembly reflow". Ultimately, both result in delamination failure. Other papers have shown the negative effects of entrapped moisture before lamination including delamination, red color, reduced thermal reliability and increased high speed signal loss. In this paper, various materials were tested for moisture sensitivity during lamination. Tests were performed at varying lamination conditions including a pre-vacuum step and "kiss" step. Pressure and cure temperature parameters were evaluated for minimizing or eliminating the effect of trapped moisture. Also included are the results of inner layer moisture removal baking conditions and their effect on peel strength and thermal reliability.
Proven Peel Back Force Measurement Supplying consistent SMT carrier packaging is critical for customers using SMT pick-and-place machines. Nothing will stop a production line faster than carrier cover tape that doesn’t peel back properly. The proble
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
GPD Global | https://www.gpd-global.com/peel-force-testing-info.php
Peel Force Testing (PBFT) Info Home Products Fluid Dispensing Equipment High Precision Dispenser - MAX Series Large Format Board Dispensing - DS Series Table Top Dispensing Equipment Loader
| https://www.eptac.com/wp-content/uploads/2015/02/eptac_03_18_15-1.pdf
