New SMT Equipment: peeling of (2)

Newest Bentchtop Pick and Place machine NeoDen3V with cameras-Upgrade version of TM245P

Newest Bentchtop Pick and Place machine NeoDen3V with cameras-Upgrade version of TM245P

New Equipment | Pick & Place

Brief Introduction NeoDen3V is an upgraded version of TM245P series. It features dual head, 44 feeder slots, vision system and flexible positioning system, which is suitable for prototyping, small-medium batch production with stable performance and

NeoDen Tech Co.,Ltd.

Pick and Place Prototype Machine of SMT Production Line NeoDen3V with cameras equip 42 feeders-support tape reel,tube,tray package Components

Pick and Place Prototype Machine of SMT Production Line NeoDen3V with cameras equip 42 feeders-support tape reel,tube,tray package Components

New Equipment | Prototyping

Brief Introduction NeoDen3V is an upgraded version of TM245P series. It features dual head, 44 feeder slots, vision system and flexible positioning system, which is suitable for prototyping, small-medium batch production with stable performance and

NeoDen Tech Co.,Ltd.

Electronics Forum: peeling of (22)

Photoresist+ Peel of Cu surface

Electronics Forum | Sat Feb 12 06:10:48 EST 2011 | lafir

Flexible substrate coated by PR+, found many open trace. The Photo resist peels off from CU surface randomly creating open circuit during devolopement. Any ideas???

Immersion of PWB

Electronics Forum | Wed Nov 03 19:56:50 EST 2004 | Dreamsniper

Hi, I wanna know if I immerse my fully populated PWB in a solution with 90% IPA and 10% De-ionized water at 80'C, will there be a problem or issue? Will my board or components be damaged? Will my PWM Mask peel off? What are the possible damage that

Industry News: peeling of (8)

Nordson ASYMTEK Introduces Panorama™ Conformal Coating Line Solutions to Fit a Range of Production Processes

Industry News | 2019-10-02 16:32:48.0

Nordson ASYMTEK is pleased to introduce its Panorama™ conformal coating line solutions, providing a balance of equipment and process control for optimal efficiency in automated conformal coating.

ASYMTEK Products | Nordson Electronics Solutions

The System of X-ray Radiography Non-destructive Testing technology

Industry News | 2021-11-30 01:54:12.0

After more than 100 years of development, X-ray imaging technology has formed a relatively complete X-ray non-destructive testing (NDT) technology system. In order to meet these needs, new detection technologies are constantly innovating, using Xray inline inspection technology. It can not only detect invisible crack or porosity such as aluminum casting , but also qualitatively and quantitatively analyze the detection results to find flaws early.

Unicomp Technology Co., Ltd

Technical Library: peeling of (2)

Development of Halogen Free, Low Loss Copper-Clad Laminates Containing a Novel Phosphonate Oligomer

Technical Library | 2017-08-24 16:53:20.0

With the rapid development of the information industry, increasing attention is being paid to the dielectric performance of base materials including copper-clad laminates (CCL) and prepregs. In addition to the increasingly high performance requirements of CCL's, the present global attention to less toxic products is leading to an increase in the use of halogen-free flame retardants in electronics. (...) This paper introduces a new phosphonate oligomer which can be used as a reactive flame retardant in epoxy based resin systems. Suitable conditions for the complete reaction between the phosphonate oligomer and epoxy resin are described and the resulting halogen-free laminates with improved properties such as low Df, low coefficient of thermal expansion (CTE), high peel strength, and good toughness are presented.

FRX Polymers Inc.

Study on Solder Joint Reliability of Fine Pitch CSP

Technical Library | 2015-12-31 15:19:28.0

Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.

Flex (Flextronics International)

Videos: peeling of (1)

No drip or drool across a wide range of fluid viscosities (low-to-mid and low-to-high) with GPD Global PCD Pumps for total control of your dispensing fluids.

No drip or drool across a wide range of fluid viscosities (low-to-mid and low-to-high) with GPD Global PCD Pumps for total control of your dispensing fluids.

Videos

http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to

GPD Global

Express Newsletter: peeling of (15)

Partner Websites: peeling of (26)


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PCB Handling with CE

High Resolution Fast Speed Industrial Cameras.
Voidless Reflow Soldering

Wave Soldering 101 Training Course
convection smt reflow ovens

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
SMT feeders

World's Best Reflow Oven Customizable for Unique Applications