Electronics Forum | Tue Nov 27 08:47:24 EST 2007 | ratsalad
The letter below was dated December 13, 2006 from Kester's Senior Market Development Engineer. I guess since then they have moved production back to Mexico. We no longer use EM907 as our primary Pb-free paste so I haven't seen any containers in a w
Industry News | 2010-10-04 17:03:39.0
Kester announces that Peter Biocca, Senior Market Development Engineer, will Co-Chair Session PRC2, titled “Strategies for Optimizing AOI and X-Ray Inspection” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL. The session will take place Wednesday, October 27, 2010 from 10:30 a.m.-12 p.m. in room Europe 1.
Industry News | 2008-03-20 20:10:01.0
ITASCA, IL � March 2008 � Kester will provide lead-free soldering products, lead-free resources and technologies in booth 1660 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas. Kester will present its latest lead-free soldering products and technologies for lead-free wave, selective and hand-soldering applications.
Technical Library | 2008-01-03 17:50:51.0
Lead-free SMT can be achieved reliably if several process requirements are implemented carefully. Some of the variables to account for are listed below. The most common alloys used in lead-free SMT are tin-silver-copper alloys; these alloys all have a meting range between 217- 220°C. These alloys all melt at higher temperatures than traditional leaded solders such as the 63/37which has a melting point of 183 °C.
Technical Library | 2009-01-15 00:42:58.0
Tin-silver-copper has received much publicity in recent years as the lead-free solder of choice. SAC305 was endorsed by the IPC Solder Value Product Council in the United States as the preferred option for SMT assembly; most assemblers have transitioned to this alloy for their solder paste requirements. The SAC305 alloy due to its 3.0% content of silver is expensive when compared to traditional 63/37 for this reason many wave assemblers are opting for less costly options such as tin-copper based solders for their wave, selective and dip tinning operations.
Developing a Reliable Lead-free SMT Assembly Process Developing a Reliable Lead-free SMT Assembly Process What are the key process requirements to achieve reliable lead-free SMT assembly? Lead-free SMT can be achieved reliably if several
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/our-company/news-room/feature-content-roll-up-page/nordson-efd-introduces-new-product-that-drastically-reduces-plastic-waste
. Peter Kuzyk, Business Manager of Fluid Formulators and Packagers, has been involved in Film-Pak’s development team since the project began
| https://www.eptac.com/category/upcoming-webinars/shown.bs.collapse/page/9/
Global Regulations & Standards – Philips Healthcare and Peter Tortorici, Ph.D., New Product Development Manager – Medtronic 10:00 am BREAK 10:15 am Optimal Choices for Lead-Free Soldering Materials Carl Seelig, AIM Solder 11:00 am
