Industry Directory | Distributor / Manufacturer
Distributor of the highest quality SMT assembly equipment. Our 45 years of combined experience and commitment to excellence have earned us the reputation as the premier distributor in the Americas.
Industry Directory | Manufacturer
Manufacturer of convection reflow ovens, vapor phase ovens, convection curing, and IR curing ovens.
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Electronics Forum | Wed Nov 17 09:28:40 EST 1999 | Steve Z
Hello, I am new to the SMT area and I need to know what a "good" vapor phase reflow profile should look like. The fluids we are using have a BP of 45 C and 219 C. Thanks,
Electronics Forum | Fri Nov 19 05:12:21 EST 1999 | Graham Naisbitt
Steve, If you can get me your snail-mail address, I will send you some latest information. We actually have a totally new system called Delta 5. It is Condensation Soldering rather than Vapour phase, the difference being that we solder in an air ti
Used SMT Equipment | Soldering - Reflow
1997 Electrovert OMNI 7 Reflow Oven Left to Right 7 Heating Zones (Top & Bottom Heaters) Edge & Mesh Transport Power: 480 VAC; 101.2A; 60Hz; 3 Phase Machine Dimensions: 194" x 54" x 56" Serial: 11871242
Used SMT Equipment | Soldering - Reflow
2004 BTU Pyramax 150N X5 Reflow Oven 10 Zones (Top and Bottom Side Heaters) 2 Cooling Zones Edge Rail & Mesh Belt 7819 Operating Hours Nitrogen Capable Power: 380 / 220VAC; 3 Phase; 119A Machine Dimensions: 260" x 60" x 65"
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2013-12-05 16:48:11.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it has been selected as a finalist for the 2014 Best in Test Awards in the Machine Vision/Inspection category for its MV-9 2D/3D CoaXPress In-Line AOI Series. Since 1991, the Best in Test Awards have recognized the best in test products and test professionals.
Parts & Supplies | Assembly Accessories
AXPC fan Assembly 949839603998 0.8M Linking Conveyor, Single Lane, for Cooling, with 6 Fan on Top MMLC-2103.8F 0.8m Linking Conveyor, without Fan MMLC-2103.8 1KURA FAN （for Samsung Reflow SRF70i82 ） U6250MKG1 1M Conveyor With
Parts & Supplies | Soldering - Reflow
Model : Heller 1809EXL Reflow Oven-1 Location：Shenzhen and Hongkong Vintage : 2006 Conveyor direction : Left to Right Board holding: Edge rail and mesh belt Air and nitrogen Power : 240V, 100A, 3-phase Condition : Very good
Technical Library | 2014-03-20 12:37:39.0
In the beginning of SMT, Vapor Phase Soldering was the preferred reflow soldering technology because of its excellent heat transfer capabilities. There were also some disadvantages like fast temperature rise, nearly no influence on the temperature profiles and high costs. So the use of Vapor Phase Soldering was reduced to special applications with high mass or complex boards in low numbers (e.g. for military or aerospace use).
Technical Library | 2019-07-23 22:33:47.0
The Quad Flat Pack No Leads (QFN) style of leadless packaging [also known as a Land Grid Array (LGA)] is rapidly increasing in us e for wireless, automotive, telecom and many other areas becaus e of its low cost, low stand-off height and excellent thermal and electri cal properties. With the implementation of any new package type, there is always a learning curve for its use in design and processing as well as for the Process and Quality Engineers who have to get to grips with the challenges that these packages bring. Therefore, this paper will provide examples of the common process defects that can be seen with QFNs /LGAs when using optical and x-ray inspection as part of manufacturing quality control. Results of trials conducted on four PCB finishes and using vapour phase and convection reflow will be discussed.
Nano-copper sintering in formic acid vapor.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,
Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | THRISSUR, India | Maintenance,Production
HANDLING OF MAINTENANCE Camelot,Mascot, Selective Soldering,Wave Soldering,Aquastorm 200,H-500 HI-Z,Kolb,kerry&PBT,GETECH, ATI 105 & Final Touch 101,Heller,Btu&vapour phase,Shuttle,SRT,ESD ,Electrical maintenance . Knowledge in using SLIM KIC 2000&
Career Center | tulsa, Oklahoma | Engineering
Printed Circuit Assembly Process Engineer. Seeking a position in a high-technology operation, utilizing my background supporting a progressive and growth-oriented organization. Offering the technical experience, expertise, and skills gained during th
Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints SMTnet Express September 13, 2012, Subscribers: 25475, Members: Companies: 8976, Users: 33645 Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints First published
SMTnet Express, March 20, 2014, Subscribers: 22559, Members: Companies: 13833, Users: 35907 Today's Vapor Phase Soldering. An Optimized Reflow Technology for Lead Free Soldering. Dipl.-Ing. Helmut Leicht; Andreas Thumm; IBL-Löttechnik Gmb
| https://www.feedersupplier.com/sale-13240943-original-new-offline-spc-single-phase-220v-smt-spi-machine.html
Original New Offline SPC Single Phase 220V SMT SPI Machine Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
| https://www.eptac.com/faqs/ask-helena-leo/ask/vapor-phase-soldering-to-immersion-tin-plated-pads
%3D4684411 Although the temperature of the vapor phase material is high enough, the problem appears to be the tin oxide on the surface of the board which is preventing the reflow of the solder
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