Industry Directory | Manufacturer
Integran makes nanocrystalline nickel SMT solder stencil blanks that are subsequently laser cut into the high durability and very precise stencils. We make 500-1000 a month of 22.5" x 24" foils.
Industry Directory | Manufacturer
Qualitetch utilse photo etching, wire EDM, laser cutting, metal forming, machining to offer the "Total Metal Component Solution" to customers requiring thin gauge metal components in most metals.
AGR Automation Ltd, previously the Panmure Tool & Engineering Company, has designed and manufactured profile skiving machines for more than 20 years. Technical Info: Can operate with up to 5 heads cutting simultaneously using the very latest in DC
Great Lakes Engineering boasts over 20 years in chemical etching technology. In essence, this is the process of printing (photo-plotting) a pattern on a metal foil and immersing it in a precise combination of chemistry in order to eat through (etch t
Electronics Forum | Fri Jan 15 09:36:20 EST 1999 | Earl Moon
| Folk's, | | I'm looking for information of how long you cna store a gold finish PCB before building it. I know there are problems with the gold disappearing into the underlying nickle over time / temperature etc but exactly how long do you have be
Electronics Forum | Fri Jan 15 11:28:50 EST 1999 | Bob Willis
| | Folk's, | | | | I'm looking for information of how long you cna store a gold finish PCB before building it. I know there are problems with the gold disappearing into the underlying nickle over time / temperature etc but exactly how long do you h
Industry News | 2019-03-21 13:53:04.0
Nathan Trotter announces that they have introduced a new line of solder products, NT100Ge, which they will offer as a replacement for SN100C® now that the related patent has expired.
Parts & Supplies | Assembly Accessories
Electrical ： Current Rating (Amps): 6 Average Probe Resistance (mOhm): 10 Materials & Finishes ： Barrel Material: Work-hardened Phosphor Bronze, Gold plated over hard Nickel Plunger Material: High performance alloy, LFRE proprietary plati
Technical Library | 2014-08-07 15:13:44.0
Gold embrittlement in SnPb solder is a well-known failure mechanism in electronic assembly. To avoid this issue, prior studies have indicated a maximum gold content of three weight percent. This study attempts to provide similar guidance for Pb-free (SAC305) solder. Standard surface mount devices were assembled with SnPb and SAC305 solder onto printed boards with various thicknesses of gold plating. The gold plating included electroless nickel immersion gold (ENIG) and electrolytic gold of 15, 25, 35, and 50 microinches over nickel. These gold thicknesses resulted in weight percentages between 0.4 to 7.0 weight percent.
Technical Library | 2013-01-17 15:34:33.0
The use of an electroless nickel, immersion gold (ENIG) surface finish comes with the inherent potential risk of Black Pad failures that can cause fracture embrittlement at the interface between the solder and the metal pad. As yet, there is no conclusive agreed solution to effectively eliminate Black Pad failures. The case studies presented are intended to add to the understanding of the Black Pad failure mechanism and to identify both the plating and the subsequent assembly processes and conditions that can help to prevent the likelihood of Black Pad occurring.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
) when the solder gold content exceeds 5% by weight. Controlling the component gold plating thickness as well as the soldering process temperature and time can prevent gold embrittlement
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