Industry Directory: phosphorus analysis enig (1)

Eastern Applied Research Inc.

Industry Directory | Distributor / Manufacturer / Manufacturer's Representative

Specializing in Xray Fluorescence, Eastern Applied offers XRF solutions for RoHS testing, thin gold measurements (ENIG, ENIPIG), solder analysis, and much more. Authorized Distributor of Hitachi High-Tech XRF analyzers.

New SMT Equipment: phosphorus analysis enig (2)

Handheld XRF

Handheld XRF

New Equipment | Other

Weighing just 3.3 lbs., the Innov-X Handheld instruments are truly portable XRF. They are ideal for instant elemental analysis of any element from Phosphorus to Uranium.

Innov-X Systems - Acquired by Olympus - NDT

Multilayer Mixed Dielectric PCB

Multilayer Mixed Dielectric PCB

New Equipment | Components

Consisting of multiple laminates and differing dielectric constants, this multilayer (displayed right) is a mixed-dielectric printed circuit board which was manufactured for the Aerospace Industry.  Multilayer Mixed Dielectric PCB Specifications:

Standard Printed Circuits, Inc.

Electronics Forum: phosphorus analysis enig (45)

Phosphorus Crystal Formation

Electronics Forum | Tue Nov 14 02:53:05 EST 2006 | saaitk

Thanks for your input folks. I will have to get back to our customer regarding the analysis as it was them that carried it out. If I can get more details then I will post them. For my own benefit, is phosphorus crystal formation to be expected using

ENIG CONTAMINATION

Electronics Forum | Wed Nov 04 13:15:53 EST 2009 | tstrat

I asked our lab about this and received this response: "Typically 7 - 9wt% phosphorus is used. Higher concentrations (10 - 12 wt% phosphorus) reportedly help prevent Ni-P corrosion during the IG processing step, but they are also reportedly more dif

Industry News: phosphorus analysis enig (4)

Volunteers Honored for Contributions to IPC and the Electronics Industry at IPC APEX EXPO 2020

Industry News | 2020-02-18 15:10:01.0

IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on February 3 and 5 at IPC APEX EXPO 2020 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.

Association Connecting Electronics Industries (IPC)

STI Electronics Releases Fine-Pitch SMT Kit with Lead-Free Option

Industry News | 2010-09-29 02:16:12.0

STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that its Fine-Pitch SMT Kit is now available in both lead-free and tin-lead versions. The lead-free component option is available with the ENIG board finish.

STI Electronics

Technical Library: phosphorus analysis enig (5)

Study of Various PCBA Surface Finishes

Technical Library | 2015-11-25 14:15:12.0

In this study various printed circuit board surface finishes were evaluated, including: organic solderability preservative (OSP), plasma finish (PF), immersion silver (IAg), electroless nickel / immersion silver (ENIS), electroless nickel / immersion gold hi-phosphorus (ENIG Hi-P), and electroless nickel / electroless palladium / immersion gold (ENEPIG). To verify the performance of PF as a post-treatment option, it was added to IAg, ENIG Hi-P, and ENEPIG to compare with non-treated. A total of nine groups of PCB were evaluated. Each group contains 30 boards, with the exception on ENIS where only 8 boards were available.

Flex (Flextronics International)

High Phosphorus ENIG – highest resistance against corrosive environment

Technical Library | 2023-01-10 20:15:42.0

Over the past years there has been consistent growth in the use of electroless nickel / immersion gold (ENIG) as a final finish. The finish is now frequently being used for PBGA, CSP, QFP and COB and more recently gathered considerable interest as a low cost under-bump metallization for flip chip bumping application. One of the largest users for this finish has been the telecommunication industry, were millions of square meters of PCBs with ENIG have been successfully used. The nickel layer offers advantages such as multiple soldering cycles and hand reworks without copper dissolution being a factor. The nickel also acts as a reinforcement to improve through-hole and blind micro via thermal integrity. In addition the nickel layer offers advantages such as co-planarity, Al-wire bondability and the use as contact surface for keypads or contact switching. Especially those pads, which are not covered by solder need a protective coating in corrosive environment – such as high humidity or pollutant gas.

Atotech

Career Center - Resumes: phosphorus analysis enig (2)

B.s (Chemical Engineering) with 2 years experience in pcb industry

Career Center | , India | Engineering,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support

I am working as lab chemist and also involved in troubleshooting and process control of various processes in pcb industry

resume_srini_chada

Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support

• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a

Express Newsletter: phosphorus analysis enig (312)

SMTnet Express - August 9, 2018

SMTnet Express, August 9, 2018, Subscribers: 31,244, Companies: 11,011, Users: 25,072 New Phosphorus-based Curing Agents for PWB A. Piotrowski, M. Zhang, S. Levchik - ICL-IP , Y. Zilberman, Eran Gluz - IMI As a result of the continuous

Partner Websites: phosphorus analysis enig (13)

SMT Processes Re-Certification

Surface Mount Technology Association (SMTA) | https://www.smta.org/certification/recertification.cfm

. James Hall are divided into 11 modules each with slides and a quiz on the following updated topics: PCB Basics and Surface Finishes like HASL and ENIG Surface Finishes like OSP, Immersion Tin, Immersion Silver Paste, stencils, printing and how they are interrelated Component placement with a focus

Surface Mount Technology Association (SMTA)

The Last Will And Testament of the BGA Void

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf

. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis

Heller Industries Inc.


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