Electronics Forum | Fri Jul 30 09:43:44 EDT 1999 | C.K.
| We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after
Industry News | 2010-04-10 02:09:54.0
If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.
Industry News | 2016-04-26 11:11:11.0
Gen3 Systems Limited, a specialist British manufacturer and distributor, sees a significant increase in demand for its redesigned line of Surface Insulation Resistance Testers (AutoSIR) and Conductive Anodic Filament Monitoring Testing System (AutoCAF).
Technical Library | 1999-05-07 10:47:00.0
White residue remaining after cleaning circuit board assemblies can be caused by a variety of chemicals and reactions. Rosin and water-soluble fluxes, circuit board resins and epoxies, component materials and other contamination all contribute to this complex chemistry. This paper discusses many of the sources of the residues that seem to be an ever-increasing occurrence.
Technical Library | 2018-05-09 22:15:29.0
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may electrically short circuit neighboring features on the PCB. The iNEMI technical subcommittee on creep corrosion has developed a flowers-of-sulfur (FOS) based test that is sufficiently well developed for consideration as an industry standard qualification test for creep corrosion. This paper will address the important question of how relative humidity affects creep corrosion. A creep corrosion tendency that is inversely proportional to relative humidity may allow data center administrators to eliminate creep corrosion simply by controlling the relative humidity in the data center,thus, avoiding the high cost of gas-phase filtration of gaseous contamination. The creep corrosion relative humidity dependence will be studied using a modified version of the iNEMI FOS test chamber. The design modification allows the achievement of relative humidity as low as 15% in the presence of the chlorine-releasing bleach aqueous solution. The paper will report on the dependence of creep corrosion on humidity in the 15 to 80% relative humidity range by testing ENIG (gold on electroless nickel), ImAg (immersion silver) and OSP (organic surface preservative) finished PCBs, soldered with organic acid flux.
SMTnet Express, February 17, 2022, Subscribers: 25,920, Companies: 11,522, Users: 27,065 Impact of Dust on Printed Circuit Assembly Reliability Atmospheric dust consists of solids suspended in air. Dust is well known for its
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
., Osaka, Japan 6Heraeus, Frankfurt, Germany 7Indium Corp., Clinton, NY, USA richard.coyle@nokia-bell-labs.com david.hillman@rockwellcollins.com ABSTRACT A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
., Osaka, Japan 6Heraeus, Frankfurt, Germany 7Indium Corp., Clinton, NY, USA richard.coyle@nokia-bell-labs.com david.hillman@rockwellcollins.com ABSTRACT A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance
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