New Equipment | Rework & Repair Equipment
BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic components. It is truly a revolutionary means to protect components. It
Ersa HOTFLOW 3/20e Reflow Oven Ersa HOTFLOW 3/20e Reflow Oven Ersa HOTFLOW Reflow Oven Ersa Reflow Oven SMT Reflow Oven Product description: Ersa HOTFLOW 3/20e Reflow Oven INQUIRY Ersa HOTFLOW 3/20e Reflow Oven Products descrip
Used SMT Equipment | Turnkey Lines
Functional Pre-Owned Complete SMT Assembly Line - Still Operational (Subject to prior sell, I am listing this on other venues) Up for sale is a full turnkey SMT line and all of it's accessories, of which there are a lot, fe
Industry News | 2023-08-22 06:02:56.0
DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD
Industry News | 2018-10-18 08:53:06.0
Mixed process of SMT reflow oven
Technical Library | 2008-03-18 12:36:31.0
This paper examines the construction of a notebook mainboard with more than 2000 components and no wave soldering required. The board contains standard SMD, chipset BGAs, connectors, through hole components and odd forms placed using full automation and soldered after two reflow cycles under critical process parameters. However, state of the art technology does not help if the process parameters are not set carefully. Can all complex BGAs, THTs and even screws be soldered on a single stencil? What will help us overcome bridging, insufficient solder and thombstoning issues? This paper will demonstrate the placement of all odd shape components using pin-in-paste stencil design and full completion of the motherboard after two reflow cycles.
Technical Library | 2020-11-24 23:12:27.0
In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-paste technology also increase solder paste use. More components and more solder paste result in more outgassing of chemistry during the reflow process. Some assemblies report condensation of vapors when the cold printed circuit board enters the oven. Little is known about the interaction between these condensed materials in terms of the interaction between these condensed materials and the reliability of the assembly. Apart from the question of reliability, a printed circuit board contaminated with a small film of residues after reflow soldering is not desirable.
LED panel is a kind of flat panel display which is composed of small LED modules. It is the largest and most widely used large-screen panel technology at present. It can be used not only indoors but also outdoors, waterproof, windproof and rain proo
Events Calendar | Sun Apr 05 18:30:00 UTC 2020 - Sun Apr 05 18:30:00 UTC 2020 | ,
Reflow Simulation – X-ray & Optical Help Solves Design & Process
Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints. The purpose
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BTU 125 SMT Reflow Machine VINTAGE 2010 10 Inner Cooling SMT Reflow Oven Zones Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
GPD Global | https://www.gpd-global.com/pin-paste-dispensing-through-hole.php
Contacts Technical Support About Company Profile News Events Awards Employment » Applications » Paste Pin-In-Paste Soldering Pin-In-Paste Solder Paste Dispensing Pin-in-Paste for Solder Reflow Technology Solder Paste is used to make the electrical connection between a PCB and component
