PVS-801 and PVS-901 - Part Verification Systems to STOP WRONG PARTS during PCB Assembly
Industry Directory | Consultant / Service Provider / Manufacturer
Utah Based Contract assembler
Hanwha DECAN S1 Pick and Place Machine Speed: 47,000 CPH PCB Size : L510xW510 Feeder input:120pcs Weight: 1600KG Product description: Hanwha DECAN S1 Pick and Place Machine, Speed: 47,000 CPH, PCB Size : L510xW510, Feeder input:120pcs, Weight: 1600K
JUKI RS-1R Pick and Place Machine Applicable Components: 0201~5050Board size:50×50-650×370mmFeeder inputs:max.112placement capacity:47,000 CPHProduct description: JUKI RS-1R Pick and Place Machine, Applicable Components: 0201~5050,Board size:50×50-6
Electronics Forum | Thu Feb 24 11:18:20 EST 2005 | Alex
Many parts falls around the tape cutter no mather the size or type. Also many times the machine misses some picks. But when doing a placement test with a single dummy part, 99% good.
Electronics Forum | Mon Feb 28 08:34:46 EST 2005 | Alex
Good advises thanks. I'll go thru all nozzles and vacuum check today and tell the programer about PD's and nozzle vs shutter. Should I check at the same time all the vacuum filter ? For the placement test, we use the same feeder at the same position.
Used SMT Equipment | Pick and Place/Feeders
Make: Assembleon Model: MG5 Vintage: 2011 Details: Fixed Feeder Banks Pneumatic FT/CL Feeder Interface (Feeders Sold Separetely) 2×24 Position Fixed Feeder Bank Front Single Placement Beam with 5 Heads Front Line Array Camera with Side Light (For
Used SMT Equipment | Chipshooters / Chip Mounters
The NXTR A model includes an automatic feeder exchange system that frees operators from changeover and supply work, with additional features that strengthen the ability to maintain high-quality and productivity. Fuji is paving the way to the future o
Industry News | 2003-05-06 09:05:12.0
New Schematic Capture and Simulation Software Delivers Innovative Features and the Industry�s Best Price/Performance
Parts & Supplies | Pick and Place/Feeders
1. How to choose FEEDER for each specification material in SMT? A circle is 4MM. The spacing between the two materials is the middle. If the size of the FEEDER is 12MM, then the material is a 12 X 4MM Feeder. Mainly to see the width of the strip,
Parts & Supplies | SPI / Solder Paste Inspection
Quick programming, friendly programming interface Multiple measurement methods True one-button measurement Eight-way motion button, one-click focus Adjustable scanning pitch Solder paste 3D simulation function Powerful SPC function MARK
Technical Library | 2008-10-29 18:45:53.0
Growing demand for compact, multi-function electronics products has accelerated component miniaturization and high-density placement, creating new challenges for the electronics manufacturing industry. It is no longer adequate to simply place parts accurately per a pre-defined CAD assembly program because solder paste alignment errors are increasing for numerous reasons. The solution to this problem is a system in which the placement machine can automatically detect and compensate for misalignment of the solder paste to produce high-quality boards regardless of the process errors beforehand.
Technical Library | 2015-04-02 20:12:58.0
The demands on volume delivery and positioning accuracy for solder paste deposits are increasing as the size and complexity of circuits continue to develop in the electronics industry. According to the iNEMI 2013 placement accuracy for these kinds of components will reach 6 sigma placement accuracy in X and Y of 30 um by 2023.This study attempts to understand the dependencies on piezo actuation pulse profile on jetting deposit quality, especially focused on positioning, satellites and shape. The correlation of deposit diameter and positioning deviation as a function of piezo actuation profile shows that positioning error for deposits increase almost monotonically with decreasing droplet volume irrespective of the piezo-actuation profile. The trends for shape and satellite levels are not as clear and demand further study.
Mirae Corporation has released the new MR series pick and place machine for SMT production. The MR series features: - 4th generation linear motor on X and Y gantry - 01005" part placement for long production runs - Z Height measurement - All feeders
ePlace defines a new standard of a user-friendly software for the operation of a complex machine. The software is intuitive, graphically, features multi-language support and makes complex things easy to understand.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Inspection Courses
The PCB inspection courses focus on improving PCB yield and reliability through validation and detection of defects on electronics assemblies.
Career Center | Fremont, California USA | Production
NRC Manufacturing, is a small, tight knit operation looking for a capable and knowledgeable SMT Machine Programmer. Experience and skill are important to us, and we’re looking for someone that can hit the ground running and knows their way arou
Career Center | , Portugal | Engineering,Maintenance,Production,Quality Control,Technical Support
SMT Process engineer Quality Efficiency Continuous improvement 11 years of experience in high volume production in a Japanese corporation Expertise in: Solder paste printing (DEK, Panasonic) Adhesive dispensing (FUJI, Panasonic) Components Pick and p
SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page << Back to Page 3 Page 5 >> Thirdly, the actual measurement of component placement starts
| http://etasmt.com/cc?ID=te_news_industry,23361&url=_print
: Less operator fatigue Fewer placement errors Better control Improved yield, less rework A machine-assisted manual system can be equipped with features such as an X-Y indexing table with vacuum pickup head or pen
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_universal-grid-system_topic2404.xml
., pad and placement roundoff errors to +-0.05mm.My question is about the creation of parts with LE that is “compliant” or usable with a 50um grid system