Industry Directory | Manufacturer
SMAC pick & place actuators are unique as they enable total programmability of speed, position and force all at the same time. SMAC's "Soft-Land" function prevents chip fracture.
JUKI JM-20 Hybrid Placement Machine Max PCB:410×560mmComponent Size:0603～50mmPlace Speed:15,500 CPHProduct description: JUKI JM-20 Multi Task Platform Hybrid Placement Machine, Max PCB:410×560mm, Component Size:0603～50mm, Place Speed:15,500 CPH
Hanwha SM485P Pick and Place Machine Placement speed: 12,000 CPH (Optimum) Machine dimension: 1650*1679*1993mm Weight: Approx 1600kg SM485P is a multifunctional Hybrid Pick and Place Machine. In addition to SMD components, it can quickly and reliabl
Electronics Forum | Wed Apr 17 08:35:17 EDT 2013 | emeto
I currently run Siemens and they have their own recommendations about placement force. Most of the passive parts will be placed using 2N. For some BGA'a we will go about 4N and for certain parts that are very easy to break you should go 1N. All parts
Electronics Forum | Sat Mar 23 23:07:02 EDT 2013 | dhanish
I have a question on component placement 1)for solder paste ,do we need to press the component into solder paste during placement process? 2)how we define force for Smt component..sometimes we add force for certain BGA?any guideline? Pls advise
Used SMT Equipment | Pick and Place/Feeders
With the SIPLACE SX we have made our most successful placement solution even better: Capacity on Demand: Scale the performance of your SMT lines up or down as needed – quickly and easily The SIPLACE SpeedStar for high-speed and placement of component
Used SMT Equipment | Pick and Place/Feeders
With the SIPLACE SX we have made our most successful placement solution even better: Capacity on Demand: Scale the performance of your SMT lines up or down as needed – quickly and easily The SIPLACE SpeedStar for high-speed and placement of component
Industry News | 2010-05-20 12:47:37.0
GAINESVILLE, GA ― Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces Universal Instruments’ GSM special low force (spring suspended) nozzle with replaceable tips for delicate components. Count On Tools’ new low force nozzles are ideal for gaas die, gallium arsenide, thin silicone (less than 0.10" in thickness), die with air bridges and flip chips.
Industry News | 2015-03-03 13:05:52.0
Count On Tools now carries PB Swiss Tools’ Cross-handle Screwdriver. The ergonomic two-component cross-handle with a sheathing made of high-quality Santoprene® fits perfectly in the hand and allows fatigue-free working. The lateral drive ensures the required force transfer while tightening or loosening the screws.
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Parts & Supplies | Pick and Place/Feeders
00314164-01 Siemens placement machine parts We also supply following Siemens SMT spare parts: 03026287-01 AIR DISTRIBUTOR Unit S25HM2 cpl. 03026511-01 CAN-BUS:EXTENSION INTERFACE 03027255S03
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Parts & Supplies | Pick and Place/Feeders
AF8X4 Mechanical Feeder Our main products are [second-hand high-speed placement machine, smt second-hand placement machine, second-hand automatic placement machine, reflow, JUKI placement machine] and so on. Our company I is one of the largest supp
Technical Library | 2007-06-27 15:43:06.0
Traditionally most flip chips were designed with large bumps on a coarse pitch. However, as the trend towards smaller, more compact assemblies continues the sizes of semiconductor packages are forced to stay in line. New designs are incorporating smaller bump diameters on increasingly aggressive pitches, and in many cases decreasing the total IO count. With fewer and smaller bumps to distribute the load of the placement force it is becoming increasingly vital for equipment manufacturers to meet the challenge in offering low force placement solutions. One such solution will be presented in the following discussion. Also presented will be ways to minimize the initial impact spike that flip chips experience upon placement.
Technical Library | 2007-08-09 12:23:10.0
Recent developments in No Flow-Fluxing Underfill (NFFUF) products have demonstrated their utility to enhance the reliability of flip chip assemblies with reduced processing steps over conventional capillary flow methods. This basic work considered processing conditions such as dispensed volume and placement force, speed and dwell time. Further evaluations of these new products on a variety of flip chip assembly configurations manufactured by various processes have been undertaken to provide further evidence of their suitability and potential in high volume electronic manufacturing. This paper summarizes the recent evaluations and discusses new studies of additional assembly configurations, which include higher input/output (l/O) counts up to full arrays in excess of 1200 l/Os.
Description SIPLACE HS-60 Placement Station Performance Specification ● Placement rate: 60,000 cph ● Placement accuracy: +/- 0.080mm@ 4 sigma ● Component sizes: up to 19.0mm x 19.0mm (0201 chips to PLCC44) ● PCB Dimms (Single conveyor): 50 x 50
Description SIPLACE HS-60 Placement Station Performance Specification ● Placement rate: 60,000 cph ● Placement accuracy: +/- 0.080mm@ 4 sigma ● Component sizes: up to 19.0mm x 19.0mm (0201 chips to PLCC44) ● PCB Dimms (Single conveyor): 50 x 50
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Career Center | melbourne, Australia | Engineering,Maintenance,Management,Production
A long established First Tier supplier to the Australian car industry, this company is now also an emerging force in the design and manufacture of automotive electronics systems to the world automotive market. Electronics production is state of th
Career Center | Lakewood, California USA | Engineering,Management,Production
Previous management / supervisor experience. Quality conscious, detail oriented supervisor / manager, with hands on approach to customer service Motivated with excellent communication skills and a dedicated team player. Qualifications include:
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Low Force Placement Solution For Delicate and Low IO Flip Chip Assemblies News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Low Force Placement Solution For Delicate
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/183452-242830-03172840-01-starin-gauge-force-fback-203357?page=580&order=list_price+asc
DEK Starin Gauge Force Fback 183452 | QYSMT × Home about Us ABOUT US FAQ SMT spare parts SMT surplus equipment SMT peripheral equipments News Contact US 0 0 Sign in contact us Products Starin Gauge Force Fback Public Pricelist Public Pricelist
| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/
. The list as I would look at it would be: Z placement force by the pick and place equipment. If the board is thicker than another board and the z axis placement does not catch it, it may apply more force when placing the components and cracking them
