Industry Directory | Manufacturer
TennMax Inc is EMI and Thermal Management Specialist. We offer total solutions for any EMI and thermal applicatons.
Industry Directory | Manufacturer
China based manufacturer looking to buy SMT Machines for own consumption.
Ersa HOTFLOW 4/20 Reflow Oven Working width: 45-560 mm Process length: 5,920 mm Heated length: 3,805 mm Cooling length: 2,115 mm Weight appr. 2,600 kg Dimension: 6,600x1,410x1,350 mm Ersa HOTFLOW 4/20 Reflow Oven Ersa HOTFLOW 4/20 Reflow Oven
New Equipment | Rework & Repair Equipment
NEW! Nitrogen Capable for High Yield Lead Free BGA Rework. NEW! Movable top and bottom gas heaters allows for easy rework near the edge and hard to ger area's of large PCB's. For high volume BGA Rework on even the largest computer and networking b
Electronics Forum | Sat Jun 11 07:51:15 EDT 2016 | davef
Hi Steve ... There are arguments between fabricators and thermal relievers about adding non-connected copper tabs to barrels in hopes of providing thermal relief, but that's not what you're talking about, I believe. I don't foresee an issue moving t
Electronics Forum | Wed Jun 08 17:35:04 EDT 2016 | slthomas
We all know that whenever possible, we want thermal relief between the barrel/pad and the copper foil to make it easier to properly solder that through hole connector. My question is, assuming there is no connection from the barrel to a copper layer
Used SMT Equipment | Pick and Place/Feeders
Universal Instruments Polaris Machine For Sale Very clean and in Good Condition See attached pictures and information below Polaris Model Number: 7514A Equipment Number: 10076306 Year 2008 Travel: 550 mm x 800mm Repeatability: +/- 0.01
Used SMT Equipment | Pick and Place/Feeders
CM88S-M 1. Theoretical speed: 0.085 seconds/point 2. Feeder configuration: 30 pieces 3. Equipment year: 2003 4. Available patch range: 0201,0402; 0603; 0805; 1206; MELF diode; Transistor, 32mQFP, SOP, SOJ, LED: 3528, 3014, 50, 5730. 5. Patch a
Industry News | 2016-11-07 16:28:47.0
GPD Global expands the performance of its automated dispense systems to run fundamental Pick & Place operations.
Industry News | 2011-08-22 15:44:33.0
GPD Global will debut its Positive Cavity Displacement (PCD) 'H' Series high-resolution pumps in Booth #1849 at the upcoming Assembly & Automation Technology Expo, scheduled to take place September 20-22, 2011 at McCormick Place North in Chicago, IL.
Parts & Supplies | Pick and Place/Feeders
BK-MOD421/2 strain relief 10pole
Parts & Supplies | Pick and Place/Feeders
BK-MOD422-C310 strain relief 10pole
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2007-01-31 15:17:04.0
The goal of this project is to evaluate the reliability of lead-free BGA solder joints with a variety of different pad sizes using several different BGA rework methods. These methods included BGAs reworked with both flux only and solder paste attachment techniques and with or without the use of the BEST stay in place StencilQuick™. The daisy chained test boards were placed into a thermal test chamber and cycled between -25ºC to 125ºC over a 30 minute cycle with a 30 minute dwell on each end of the cycle. Each BGA on the board was wired and the continuity assessed during the 1000 cycles the test samples were in the chamber.
http://www.gpd-global.com GPD Global expands the performance of its automated dispense systems to run fundamental Pick & Place operations. The same automated fluid dispensing machine is capable of dispensing fluids and also Pick & Place simple compo
Precise lines are dispensed to fill an area on a heat sink. At the end of this video, you can see a demo of placing a glass slide on top of the dispensed material to see uniformity of the area. http://www.nordsonasymtek.com
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Tue Mar 06 00:00:00 EST 2018 - Tue Mar 06 00:00:00 EST 2018 | ,
Electronics in Harsh Environments Conference - Free Pre-Conference Webinar
Events Calendar | Wed Dec 06 00:00:00 EST 2017 - Wed Dec 13 00:00:00 EST 2017 | Rolling Meadows, Illinois USA
X-Ray of PCBs Webtorial
Career Center | Sunnyvale, California USA | Engineering
Our client is a leading equipment supplier to electronic assemblers around the world. Responsibilities: Conduct technical analysis of product implementations, modifications and enhancements to product in accordance with specific customer specifi
Career Center | ELLENWOOD, Georgia USA | Production,Quality Control,Research and Development,Technical Support
SMT MACHINE OPERATION, FORKLIFT CERTIFY, SUPERVISION OF MANUFACTURING AND PRODUCTION, QUALITY CONTROL TECH., AUDIO ENGINEER SKILLS,,SET-UP OF MUSICIAL THEMES AND PLAYS.
Career Center | san diego,, California USA | Engineering,Production,Quality Control,Technical Support
SMT Process Engineer, ISO-9001, IPC-600/610/620/7711/7721, J-STD-001, Thermal profiling, Lean manufacturing.
SMTnet Express, May 7, 2020, Subscribers: 36,108, Companies: 11,001, Users: 25,793 Solutions for Selective Soldering of High Thermal Mass and Fine-Pitch Components Credits: Nordson SELECT The selective soldering process has evolved to become a
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/thermal-compounds?con=t&page=24
Thermal Interface Materials (TIM) | Thermal Compound | Nordson EFD Nordson EFD Corporate | Global Directory | Languages Division Only All of Nordson Home Products Accessories
| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/
: Problems With Stress Cracks in Ceramic Components Question: We are having a problem with ceramic SMT components (CAPS) showing stress patterns and cracking after thermal testing
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