Industry Directory | Manufacturer
Tropical Assemblies, Inc. is a 20 + year Electronic Contract Manufacturer of RF and Complex Printed Circuit Board Assemblies. Full turnkey operation from prototyping to full production box builds. AS9100/ISO Certified, ITAR reg.
Manufacturer of surface mount Stencils (laser and chem) and Screens/Masks for hybrid circuitry. High precision,quality-assured standard and ultra-fine pitch applications serviced from two fully operational facilities, geared for quick-turn response.
Hanwha HM520 Pick and Place Machine Hanwha HM520 Chip Mounter Patch speed: 80,000 CPH size:890x2370x1930mm weight:1605KG Product description: Hanwha HM520 modular pick and place machine, it's Hanwha's first modular chip mounter, 890MM length.Patch
DEK Galaxy SMT Stencil Printer Maximum printing surface： 510 mm* (X) x 508.5 mm (Y)Printing speed: 2 mm/sec to 300 mm/secWeight: Approx. 680 kgProduct description: DEK Galaxy SMT Stencil Printer, Maximum printing surface： 510 mm* (X) x 508.5 mm (Y),
Electronics Forum | Wed Jul 02 03:12:31 EDT 2003 | Joanna
We have been having problems with solder paste balls around fine pitch ICs and have decided that cleaning the boards in an ultra sonic cleaner may reomove these solder balls. However we are worried that the ultrasonic cleaning process may damage the
Electronics Forum | Sat Jun 12 19:48:47 EDT 2010 | bootstrap
I like what you're doing. 20 years ago anyone, hobbyists and tiny garage-shop companies could create electronics devices just as sophisticated and cool as big corporations. Today, SMT has largely trashed the creativity (and competition) that existe
Used SMT Equipment | Pick and Place/Feeders
Mirae Corporation Quad Meridian - 1030P SMT Pick & Place Note: This lot includes an assortment of 10 SMT feeders. Item Location: Uxbridge, MA Serial: M3100-018 Features: 5 Nozzle Head 1 Gantry 4 Modular Heads 1 Precision Upward Precision Camera
Used SMT Equipment | Pick and Place/Feeders
Software Version 4.2.4e Electrical two-pole test Electrical transistor test Shared databases Hydra Electrical measurement Hydra high speed Line mode Fast place sequence Hydra large component range Hydra fine pitch In/Out conveyor board trai
Industry News | 2016-02-27 22:07:08.0
GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.
Industry News | 2017-01-26 19:53:00.0
GPD Global will exhibit in Booth 2933 at the upcoming IPC APEX EXPO 2017 scheduled to take place February14-16, San Diego Convention Center. GPD Global will officially launch its new, fully automated dispense platform, Hyperion, and a new, low cost conformal coating system.
Parts & Supplies | Repair/Rework
The RocHard 1 MilProbe is a 0.3" long Micro-tip in a 4 3/8" long hex shape stainless steel handle. The Micro-tip is tapered to a one mil diameter tip for TAB, BGA, and other ultra fine pitch rework. The tip is either straight (SH-341) or 50? angled a
Parts & Supplies | Other Equipment
SMT Parts PANASERT Nozzle BM221 PANASONIC SMT Nozzle 1.Model PANASERT BM221 2.For PANASERT placement machine. 3.Uninterrupted operation 4.Tip made by Diamond steel 5.No.10807GH11AA 1.Panasonic's BM modular high speed multi-functio
Technical Library | 2008-01-16 18:25:55.0
The consumer's interest for smaller, lighter and higher performance electronics products has increased the use of ultra fine pitch packages, such as Flip Chips and Chip Scale Packages, in printed circuit board (PCB) assembly. The assembly processes for these ultra fine pitch packages are extremely complex and each step in the assembly process influences the assembly yield and reliability.
Technical Library | 2010-03-25 06:26:37.0
The complexity of Printed Circuit Assembly process is increasing day by day and causing productivity issues in the industry, introducing ultra fine pitch components (pitch less than 15mil) in PCA is a challenge to minimize risk of defects as solder short, dry solder. This paper is focusing on minimizing these defects.
Software Version 4.2.4e Electrical two-pole test Electrical transistor test Shared databases Hydra Electrical measurement Hydra high speed Line mode Fast place sequence Hydra large component range Hydra fine pitch In/Out conveyor board trai
Make: Mycronic Model: My200DX-14 Vintage: 2016 SW Version: TPSys 3.3.2 Details: • Electrical Two-Pole Test • Optical Centering • Barcode Reader • Conveyor • Shared Databases • HYDRA • Z High Speed • HYDRA High Speed • Autoteach • Linescan for Z
Training Courses | | | IPC-7711/7721 Specialist (CIS) Recert.
The Certified IPC-7711/7721 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-7711/7721 Specialist.
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Events Calendar | Wed May 10 00:00:00 EDT 2017 - Wed May 10 00:00:00 EDT 2017 | Itasca, Illinois USA
Kester to Host Technical Rework Seminar
Career Center | Lapu-lapu, Cebu Philippines | Engineering,Maintenance,Production
Sept. 2, 2009 to Present, TPM2, LEAR Corporation, MEPZ-1, Lapu-Lapu City • Provides SMT engineering support to day-to-day manufacturing operations. • Handles SMT pick-and-place machine (Fuji, CP7, CP6 and QP242 Series, Universal Genesis GI-14D). •
Career Center | Fredericksburg, Virginia USA | Engineering,Maintenance,Management,Production,Quality Control
• Certified CP643 Loader Calibration – FUJI American Chicago, IL 2001. • Certified - Cookson Performance Solutions BTU - PARAGON - P150 Oven – Maintenance & Electrical Troubleshooting Charlotte, NC 2001. • Certified UNIVERSAL (GSM) Platform: Operat
SMTnet Express, December 31, 2015, Subscribers: 23,946, Members: Companies: 14,865, Users: 39,660 Study on Solder Joint Reliability of Fine Pitch CSP Yong Hill Liang, Hank Mao, YongGang Yan, Jindong (King) Lee; AEG, Flex (Flextronics International
SMTnet Express, December 20, 2018, Subscribers: 31,551, Companies: 10,666, Users: 25,526 Process Optimization for Fine Feature Solder Paste Dispensing Credits: Indium Corporation With the rapid trend towards miniaturization in surface mount
| http://etasmt.com/cc?ID=te_news_industry,3361&url=_print
. Solder joint dimensions in SMT quickly become much smaller as advances are made toward ultra-fine pitch technology. The reliability of solder joints become more of a concern, as less and less solder is allowed for each joint
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/products/bondtesters/vision-systems
. Based on medical endoscope technology, it is perfect for ultra fine pitch devices such as fine wire bonds or very small geometries such as micro bumps and copper pillars
