The phoenix microme|x is a high-resolution 180 kV microfocus X-ray inspection system for real time inspection of solder joints and electronic components as well as for automated inspection (µAXI). Innovative and unique features and an extreme high po
In-line X-ray and optical inspection for high-end electronics production. TRAILBLAZING X-RAY TECHNOLOGY AND ULTRA-MODERN XM CAMERA TECHNOLOGY IN ONE SYSTEM. The in-line X-ray system X7056-II is primarily distinguished by high throughput and first-c
Industry News | 2018-02-20 12:57:12.0
[December 29, 2017 – Taipei, Taiwan] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join IPC APEX 2018 held at San Diego Convention Center on February 27th - March 1st featuring innovative one-stop inspection solution for Industry 4.0-based PCBA manufacturing. Visit booth #1317 to see TRI's all new 3D SPI, 3D AOI, 3D Planar CT AXI and ICT solutions in action and discuss your inspection requirements with TRI's experts.
Industry News | 2025-11-03 14:30:58.0
Nordson TEST & INSPECTION today announced plans to exhibit with distributor partners at Productronica and SEMICON Europa, scheduled to take place November 18-21 at the Messe Munchen in Munich, Germany. Visitors to SmartTec's booths #A2.540, A2.537 and HTT's booth # B1.102 will have the opportunity to see demonstrations of Nordson's WaferSense® semiconductor sensors, SQ5000™Pro Multi-Function system for AOI, SPI and CMM, Quadra Pro™ Manual X-Ray system (MXI), Gen 7™ Acoustic Micro Imaging (AMI) system and X3 Automated X-Ray (AXI) system with Dynamic Planar CT.
Highly flexible, multi-axis inspection system featuring a parallel-kinematic Hexaglide manipulation unit that allows extreme off-axis X-ray transmission in the smallest of space with maximum speed and in high resolution. This technology is especially
SMTnet Express, May 21, 2015, Subscribers: 22,770, Members: Companies: 14,358, Users: 38,224 Reliability of Embedded Planar Capacitors under Temperature and Voltage Stress Mohammed A. Alam, Michael H. Azarian, Michael Osterman and Michael Pecht
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
+ cycles Investigation Conclusion: Overall void density on BGA component was not high Solder crack path typically found at solder joint / BGA package interface 165 Planar (flat
