Industry Directory | Manufacturer
Hi-Rel Thick Film Substrates, Multilayer, Thru-Hole/Edge Around, 2mil Lines Etched Conductors
Industry Directory | Manufacturer
professional manufacturer of pcb
New Equipment | Board Handling - Conveyors
Product features: This type of handprint table is mainly designed for single and double-sided circuit board solder paste or red glue printing requirements. The working platform is processed by honeycomb positioning holes of high-quality aluminum pla
technical parameter Model: s1200 (special type for LED light bar) Overall dimension (L × w × h): 1650 × 620 × 1550 (mm) Platform size: 320 × 1300 (mm) PCB size: 250 × 1250 (mm) Applicable template size: 550 ×
Electronics Forum | Wed Dec 17 09:53:26 EST 2003 | davef
IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards, Table 9-3 � Plated Through Hole Diameter To Lead Diameter Relationships will give you the standard information you require. If we can�t get proper hole fill after try
Electronics Forum | Wed May 27 13:42:08 EDT 1998 | Chrys
| R&D is currently designing a board with smt components on both sides of the board. They are adding a 16 pin IC Gull wing. on the bottom side of the board. I have asked for only caps and resistors to be placed on the bottom side. Is there a recommen
Used SMT Equipment | THT Equipment
Spare parts for Universal Radial and Axial through-hole insertion machines Model specifications: (RAD5 6360D, RAD8 6380A, RAD8 XT 6380B, VCD5 6241D, VCD8 6241F, VCD Dual 6292A, SEQ 2596A, SEQ5, SEQ8). UIC Part Number / Part Description 15754 O
Used SMT Equipment | Pick and Place/Feeders
Spare parts for Universal Radial and Axial through-hole insertion machines (RAD5 6360D, RAD8 6380A, RAD8 XT 6380B, VCD5 6241D, VCD8 6241F, VCD Dual 6292A, SEQ 2596A, SEQ5, SEQ8). UIC Part Number / Part Description 15754 O'RING 15755 O'RING 15759
Industry News | 2013-07-22 09:54:27.0
GPD Global has introduced its new NCM5000 dispense pump for easy jetting. With only two wetted parts and no seals or springs to replace or adjust, field operation is simple.
Industry News | 2017-10-02 13:58:42.0
GPD Global will exhibit at the upcoming IMAPS 2017. At booth 244, GPD Global will exhibit a complete line of Fluid Dispensing pumps with the latest dispense technologies for integration or retrofit. Whether your process requires low or high viscosity fluids, thick pastes, or abrasive media, there is a dispense pump to meet your requirements.
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Parts & Supplies | Pick and Place/Feeders
JUKI Mounter Chain Introduction (1) JUKI Mounter towline shape like a tank chain, composed of a number of unit links, links between the rotation freely. (2) the same series of towline within the high, high, the same pitch, towline width, bending ra
Parts & Supplies | Pick and Place/Feeders
KXFB02QQB01 BRACKET 0 KXFB0210A00 PIN 0 KXFB04W5A00 BRACKET 0 KXFX03EHA00 PRESSURE-SW ISE30-01-25-M-X114 N510066819AA JOINT KQ2N04-M5A KXF0DR2AA00 JOINT GWS6-8 N210022436AB COVER 0 N210035700AA HOLDER 0 KXFB04UJA00 GUIDE 0 KXFB0AQ7A00 STOPPE
Technical Library | 2023-11-14 19:52:11.0
The continuous drive in the Electronics industry to build new and innovative products has caused competitive design companies to develop assemblies with consolidated PCB designs, decreased physical sizes, and increased performance characteristics. As a result of these new designs, manufacturers of electronics are forced to contend with many challenges. One of the most significant challenges being the processing of thru-hole components on high thermal mass PCBs having the potential to exceed 20 layers in thicknesses and have copper mass contents of over 40oz. High thermal mass PCBs, coupled with the use of mixed technologies, decreased component spacing, and the change from Tin Lead Solder to Lead Free Alloys has lead many manufacturing facilities to purchase advanced soldering equipment to process challenging assemblies with a high degree of repeatability.
Technical Library | 2019-07-17 17:56:34.0
The increased demand for electronic devices in recent years has led to an extensive research in the field to meet the requirements of the industry. Electrolytic copper has been an important technology in the fabrication of PCBs and semiconductors. Aqueous sulfuric acid baths are explored for filling or building up with copper structures like blind micro vias (BMV), trenches, through holes (TH), and pillar bumps. As circuit miniaturization continues, developing a process that simultaneously fills vias and plates TH with various sizes and aspect ratios, while minimizing the surface copper thickness is critical. Filling BMV and plating TH at the same time, presents great difficulties for the PCB manufactures. The conventional copper plating processes that provide good via fill and leveling of the deposit tend to worsen the throwing power (TP) of the electroplating bath. TP is defined as the ratio of the deposit copper thickness in the center of the through hole to its thickness at the surface. In this paper an optimization of recently developed innovative, one step acid copper plating technology for filling vias with a minimal surface thickness and plating through holes is presented.
http://www.gpd-global.com Tilt-and-Rotate configuration is available. Full featured programming makes conformal coating processes quick and easy. 3-axis Conformal Coating System for printed circuit boards that provides a reliable robotic platform f
BEST Inc master instructor Norman Mier demonstrates how to replate gold fingers using the BEST gold contact replating kit. In this video he demonstrates how to repair, prepare and replate the finger using a gold replating solution. If you want to lea
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Career Center | Warminster, Pennsylvania USA | Production,Quality Control
PCB component level assembly - soldering under microscope. *Soldering and mechanical assembly using excellent solder skills, manual dexterity, depth perception and attention to detail. *Perform or inspect component replacement and rework on units.
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
| https://www.eptac.com/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces/
. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before? Answer: There is a metallurgy issue with soldering to nickel plated surfaces and depending upon the thickness of the final tin/lead coating, the steam aging will penetrate the finish coating and create a
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=3
0.025", smallest hole 0.015", all Plated holes, smallest trace/space 0.007", Green LPI Mask, White Top Silkscreen, Individual board with Single circuit design and No Multiple images of boards. File type: 274x required. No paint
