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D&H offers an automatic dosing machine for degassing, proportioning, mixing and high precision dosing of two component resins (epoxy, polyurethane, silicone..) in the atmospheric environment. Model:PGB-650 PGB-650 system accurately meters, mixes a
ERSA mobile scope - camera units with lenses and desk-top holder ERSA mobile scope - solder joint inspection in the twinkling of an eye The ERSA mobile scope is a compact and handy, portable video microscope to inspect solder joints in electronic
Electronics Forum | Fri Aug 22 09:44:45 EDT 2003 | davef
Kenny: Since you need to use water soluable flux and can't use no-clean, consider asking your board fabricator to plug the via.
Electronics Forum | Fri Aug 22 09:41:49 EDT 2003 | davef
Mantis: Kenny reflows paste on [wave solders] all via, not just the test via, to plug the via and provide for a pressure seal between the board and the test fixture. Beyond that, since solder is softer than copper [and fills the hole better], solde
Industry News | 2018-10-18 10:40:04.0
Via Tent-Holes with Solder Mask
Technical Library | 2019-10-10 00:26:28.0
Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to "Fill the Void." This paper is part four of this series. The focus of this work is to mitigate voids for via in pad circuit board designs. Via holes in Quad Flat No-Lead (QFN) thermal pads create voiding issues. Gasses can come out of via holes and rise into the solder joint creating voids. Solder can also flow down into the via holes creating gaps in the solder joint. One method of preventing this is via plugging. Via holes can be plugged, capped, or left open. These via plugging options were compared and contrasted to each other with respect to voiding. Another method of minimizing voiding is through solder paste stencil design. Solder paste can be printed around the via holes with gas escape routes. This prevents gasses from via holes from being trapped in the solder joint. Several stencil designs were tested and voiding performance compared and contrasted. In many cases voiding will be reduced only if a combination of mitigation strategies are used. Recommendations for combinations of via hole plugging and stencil design are given. The aim of this paper is to help the reader to "Fill the Void."
About the machine please contact whatsapp 0086 134 2516 4065 D&H offers an automatic dosing machine for degassing, proportioning, mixing and high precision dosing of two component resins (epoxy, polyurethane, silicone..) in the atmospheric enviro
This is an indepth video showing you how to rework a BGA using the PDR IR-E3 with CCTV/Split prism vision alignment rework station from our Evolution series. We call this system the E3Vi For further details on PDR Focused IR rework stations/systems
GPD Global | https://www.gpd-global.com/pdf/doc/FPC-with-Time-Pressure-Control-in-FLOware-Software-22240106.pdf
FPC with Time Pressure Control - Integrated can process any application for which that reservoir is compatible (e.g., patterns, dots, lines), in a wide range of material viscosities: cream solder, silver paste, epoxies, bond, oil, etc. Theory of
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