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DFT（Design For Testability）Software Tebo TA V5.0 ( DFT Design for testability of software) Is unique within the electronics industry also has CAD Gerber Input connector professional / Fast Design for Testability analysis software. Can quickly and
Quick Overview Max 400×600 mm soldering area Infrared ic heater T962C works automatically by micro-computer control. Can satisfy a dissimilarity SMD、BAG Soldering a request. Whole soldering process to complete automatically, easy to use, Adoption
Electronics Forum | Fri Sep 06 13:49:17 EDT 2002 | soupatech
Question: I am going to start placing 3mm x 3mm plastic smt leds and want the absolute lowest errors caused by the nozzle either dropping or allowing the part to shift. Would a 2.5mm nozzle be too big for the 3mm part. My logic is that the more surfa
Electronics Forum | Thu Sep 12 16:17:07 EDT 2002 | soupatech
There seems to be less play in the pocket than with other parts i've loaded. I was assuming the large nozzle would work better but for reasons unknown to me it didn't. I also tried a 1mm and had parts all over the machine (can you say hand place 100+
Industry News | 2018-10-18 08:27:03.0
An Analysis of SMT Solder Paste Printing Defects
Industry News | 2018-10-18 10:13:08.0
The Application of the Pin-in-Paste Reflow Process
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
BESTEMP reflow checker 6 channel temperature profiler Reflow soldering temperature tester Characteristic: 1..High efficiency, data can be stored up to 16 times continuously, and can be downloard to computer for group data viewing. 2. Modular analys
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| http://etasmt.com/cc?ID=te_news_industry,23962&url=_print
. Is the layout designed for the PIP process? If the PCB hole diameter is too big, it will require too much solder to fill it up. If it is too small, it is very difficult to fill the hole properly with paste during solder paste printing
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/012821-medical-manufacturing-ways-to-improve-fluid-dispensing-control
. With the old method, the beads were either too thick, too thin, or overlapped, and the dots of paint were too big or too small. Sometimes the beads or dots were dragged across the surface, rendering the product unusable
