HTC-300 is designed for screen printing in flex circuit and printed electronic applications where stable resistance values at elevated temperatures are required. Utilizes a high Tg (glass transition temperature) thermoplastic copolymer binder fo
Electronics Forum | Sat Nov 14 08:58:38 EST 1998 | Earl Moon
| I keep hearing about polyimide stencils, but what are they like in terms of registration and aperture accuracy? | You are hearing about polyimide as in polyimide film as Kapton (TM Dupont). This material is the stuff of flex and rigid/flex circuit
Electronics Forum | Thu Apr 22 15:27:44 EDT 1999 | Hugh M
| | I keep hearing about polyimide stencils, but what are they like in terms of registration and aperture accuracy? | | | You are hearing about polyimide as in polyimide film as Kapton (TM Dupont). This material is the stuff of flex and rigid/flex c
Industry News | 2013-04-05 11:14:05.0
A-Laser, will highlight its new laser marking capability in Booth #521 at the Del Mar Electronics & Design Show (DMEDS), scheduled to take place May 1-2, 2013 at the Del Mar Fairgrounds in San Diego, CA.
Technical Library | 2019-05-21 17:20:36.0
Die attach material selection and process implementation play crucial roles in any microelectronic assembly. The chosen attach methods ultimately affect die stress, functionality, thermal management, and reliability of the assembly. Die attach applications are designed to optimize mechanical attachment of the die to the substrate, to create a thermal path from the die to the substrate, and to create an electrical path for a ground plane connection. Some of the more commonly used die attach materials in the microelectronics industry today are epoxies,polyimides, thermoplastics, silicones, solders, and special low outgassing, low stress, anisotropic adhesives.
