New Equipment | Rework & Repair Equipment
Poor handling procedures may sometimes damage corners and edges on printed circuit boards. Most of these types of damage to PCB's can be repaired using the BEST Board Repair Kit. This versatile repair kit along with our clear "how to" instructions of
Please visit our main microsectional analysis page for more information. Process Sciences uses microsection for both failure analysis and process validation. Our cross sections reveal intermetallic layers, defects, and other physical characteristic
Electronics Forum | Tue Aug 10 05:32:42 EDT 2004 | praveen_madaan@jabil.com
Hi, Has any body experienced the problem of poor cotacts on HDMI connectors. The connectors pins are gold plated and we see some kind of white residue on the gold pins.How to check if this is a flux residue?We are using No Clean flux in wave solderin
Electronics Forum | Tue Jul 30 17:47:50 EDT 2002 | davef
Dewetting: Solder does not adhere to lead or land, caused by: * Poor solderability of lands. * Poor solderability of leads. * Solder paste integrity. * Lead plating integrity. Need more information, please: * What is dewetting [ie, component, pad, e
Industry News | 2016-09-14 17:44:33.0
IPC – Association Connecting Electronics Industries® will present “PCB Troubleshooting” on November 2, 2016 in Raleigh, N.C. in conjunction with regional trade show, PCB Carolina.
Industry News | 2009-02-03 13:34:04.0
New PCB Rework, Repair, Fabrication Training & Consulting Services.
Parts & Supplies | Pick and Place/Feeders
Smt Fuji NXT H01 nozzles 1.0 nozzle AA0AS00 used in pick and place machine Smt fuji nozzles models: FUJI NXT NOZZLE H01 PLACING HEAD Part Number Description AA0AS00 Nozzle 1.0 AA06800 Nozzle 1.3 AA0HL00 Nozzle 1.8 AA0HM00 Nozzle 2.5 AA0HN00
Parts & Supplies | Pick and Place/Feeders
Smt Fuji NXT H01 nozzles 1.0 nozzle AA0AS00 used in pick and place machine Smt fuji nozzles models: FUJI NXT NOZZLE H01 PLACING HEAD Part Number Description AA0AS00 Nozzle 1.0 AA06800 Nozzle 1.3 AA0HL00 Nozzle 1.8 AA0HM00 Nozzle 2.5 AA0HN00
Technical Library | 2020-10-18 19:35:05.0
Interconnect reliability especially in BGA solder joints and compliant pins are subjected to design parameters which are very critical to ensure product performance at pre-defined shipping condition and user environment. Plating thickness of compliant pin and damping mechanism of electronic system design are key successful factors for this purpose. In additional transportation and material handling process of a computer server system will be affected by shock under certain conditions. Many accessories devices in the server computer system tend to become loose resulting in poor contact or solder intermittent interconnect problems due to the shock load from the transportation and material handling processes.
This video is on the repair of damaged corners presented by the professional instructing staff at BEST Inc. Corners get damaged from improper handling, storage or packaging. The repair of these damaged corners for multiple angles including both abov
SMT Express, Issue No. 2 - from SMTnet.com Volume 1, Issue No. 2 Wednesday, July 14, 1999 Featured Article Continued From Previous Page PRINTED CIRCUIT BOARD FABRICATION BASICS AN OUTLINE Earl Moon Proof Of Design (POD) 8. PLATING (AND
Blackfox Training Institute, LLC | https://www.blackfox.com/how-to-remove-oxidation-from-soldering-iron-tips/
: Home Blog How To Remove Oxidation From… Mar 8 2021 Blog News & Events Soldering Poor soldering tip maintenance is a common culprit in most soldering issues
Imagineering, Inc. | https://www.pcbnet.com/blog/material-choices-for-high-speed-flexible-circuits/
. Flexible circuits are handy, but the most significant problem they present is poor performance in high-speed applications. For this reason, PCB designs that incorporate this type of technology sometimes have to be creative in the application of flexible circuits
