Industry Directory | Distributor / Manufacturer / Manufacturer's Representative / Standards Setting / Certification / Training Provider
PB Technik supplies SMT equipment and materials to the Polish market. JUKI ERSA EKRA BRADY MARANTZ
New Equipment | Soldering - Other
High specification, bench top rotary table soldering machine A versatile four station rotary bench top soldering machine, ideally suited for high or low volume production, the Quadron combines well proven pumped soldering techniques with advanced PL
New Equipment | Soldering - Other
High specification, bench top rotary table soldering machine A versatile four station rotary bench top soldering machine, ideally suited for high or low volume production, the Quadron combines well proven pumped soldering techniques with advanced PL
Electronics Forum | Thu Jun 04 19:53:44 EDT 2009 | davef
For low volume work and repair, just use a brush dipped in tacky flux to apply flux to the ball array.
Electronics Forum | Mon Jun 01 21:40:18 EDT 2009 | kircchoffs
i need some inputs regarding this process. is this really eliminates voids and other solderability issues on BGA's?
Used SMT Equipment | Soldering Equipment/Fluxes
2003 VITRONICS - SOLTEC MySelective 6748 Selective Solder Dimensions: 91" x 82" x 80" Serial: _0312722701 Features: External X-Y Spray Fluxer, Multiwave Pot, Wave Height Measurement System, Combined SelectWave and MultiWave Soldering Technology,
Used SMT Equipment | Soldering - Wave
SENSBY Wave soldering machine for sales. Vintage 1996 Model : I L F - 250 F Comes with N2 features, total seal enclosed . With TORAY Oxygen analyzer. Great working condition , for immediate production use Visit YOUTUBE nathan.jack75 to vi
Industry News | 2012-07-12 10:34:27.0
The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.
Industry News | 2012-07-12 10:34:54.0
The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.
Parts & Supplies | Pick and Place/Feeders
We can supply FUJI NXT/NXT II/NXT III/XPF/AIMEX feeders: 4MM W04b / W04f 8MM W08 / W08b / W08c / W08f / W08n 12MM W12 / W12c 16MM W16 / W16c 24MM W24 / W24c 32MM W32 / W32c 44MM W44 /
Parts & Supplies | Pick and Place/Feeders
12MM W12 / W12c 16MM W16 / W16c 24MM W24 / W24c 32MM W32 / W32c 44MM W44 / W44c 56MM W56 / W56c 72MM W72 88MM W88 Also Single Stick Feeders Vibratory Stick Feeders Ro
Technical Library | 2014-06-02 11:03:45.0
With the advancement of the electronic industry, package on package (POP) has become increasingly popular IC package for electronic devices, particularly POP TMV (Through Mold Vials) in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far no customer has reported using these methods or materials in their mass production. In order to address these issues for POP TMV assembly, YINCAE has successfully developed and commercialized the first individual solder joint encapsulant adhesive for mass production for years.
Technical Library | 2017-08-17 12:23:27.0
A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes, and imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achieved by a well-engineered miscibility between epoxy and no-clean solder paste flux systems, and is further assured with the introduction of a venting channel. The compatibility enables a single bonding step for BGAs or CSPs, which exhibit high thermal warpage, to form a high-reliability assembly. Requirements in drop test, thermal cycling test (TCT), and SIR are all met by this epoxy flux, EF-A. The high viscosity stability at ambient temperature is another critical element in building a robust and userfriendly epoxy flux system. EF-A can be deposited with dipping, dispensing, and jetting. Its 75°C Tg facilitates good reworkability and minimizes the adverse impact of unfilled underfill material on TCT of BGA assemblies.
Ultra-flexible, offline, multi-platform, quick load twin PCB rotary table selective soldering system Designed to meet the needs of the small batch manufacturer who requires high levels of production flexibility. The Jade Prodex offers the ability to
Ultra-flexible, offline, multi-platform selective soldering system Designed to meet the needs of the small batch manufacturer who requires high levels of production flexibility. The Jade Pro offers the ability to regularly change solder alloys witho
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Events Calendar | Wed Oct 23 00:00:00 EDT 2019 - Thu Oct 24 00:00:00 EDT 2019 | Guadalajara, Mexico
SMTA Mexico Expo 2019
Career Center | Clearwater, Florida USA | Maintenance,Production,Quality Control,Technical Support
I have approximately 14 years experience in the Electronics manufacturing industry. I have experience from manual assembly to machine technical support for SMT eqiupment. I also have some experience with AI equipment. I have Automatic Optical Inspect
Career Center | Chennai, India | 2017-03-01 02:21:39.0
Maintenance,Technical Support
SMTnet Express, January 15, 2014, Subscribers: 26472, Members: Companies: 13551, Users: 35633 Advanced Rework Technology and Processes for Next Generation Large Area Arrays, 01005, PoP and QFN Devices by Brian Czaplicki; Air-Vac Engineering BGA
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/fluid-types/flux
. As bump sizes decrease, it is more difficult to control dipping operations to consistently deliver smaller amounts of flux. Problems such as too much flux, excessive flux residue, or inconsistent flux application significantly degrade the ability of the underfill encapsulant to uniformly adhere to all surfaces beneath the chip
| https://www.eptac.com/faqs/ask-helena-leo/ask/wave-solder-machine-flux-system-testing-on-a-budget
: In selecting a flux, the first thing you want to check out is: does it improve the soldering compared to the existing flux? This can be done by dipping comparative samples into each flux pot and dipping them in a solder pot and checking the soldering, i.e
