Industry Directory: pop reflow (1)

Shin Puu Technology Co., Ltd

Industry Directory | Manufacturer

SP is a high mix low to medium volume PCB + PCBA shop located in Taiwan. We are in business since 2001 with over 1,000 active customers and certified to ISO-9001, ISO-14001 standards.

New SMT Equipment: pop reflow (20)

BGA X-Ray Inspection Services

BGA X-Ray Inspection Services

New Equipment | Assembly Services

BEST can provide you with analysis services for your BGAs using x-ray equipment. We rework thousands of BGAs and POPs every year, therefore, we have the expertise in BGA X-ray inspection. BEST can be your outsourced BGA x-ray inspection source for o

BEST Inc.

McDry Ultra-Low Humidity Storage Cabinets

McDry Ultra-Low Humidity Storage Cabinets

New Equipment | Board Handling - Storage

Prevent your components from micro-cracking during reflow with proper Ultra-Low Humidity Storage. DXU models of maintain1%RH Wide range of cabinets including UL/C models Conforms to IPC/JEDEC J-STD 033B.1 Dehumidifies ICs to prevent micro-crack

Seika Machinery, Inc.

Electronics Forum: pop reflow (91)

solder pop out from via hole at secondary reflow

Electronics Forum | Tue Jul 09 00:11:42 EDT 2002 | yngwie

Thanx Dave F.

solder pop out from via hole at secondary reflow

Electronics Forum | Mon Jul 08 11:53:40 EDT 2002 | yngwie

Hi Guys, We prints solder paste on via hole as the holes are used as the test points. This is a clean process. In normal production, upon completion of a primary side, board will proceed to secondary process immediately. The problem happened when

Used SMT Equipment: pop reflow (1)

Universal Instruments (3) GSM1, DEK 265GS, BTU VIP70

Universal Instruments (3) GSM1, DEK 265GS, BTU VIP70

Used SMT Equipment | Turnkey Lines

Functional Pre-Owned Complete SMT Assembly Line - Still Operational    (Subject to prior sell, I am listing this on other venues)   Up for sale is a full turnkey SMT line and all of it's accessories, of which there are a lot, fe

CybrSecurity Corporation

Industry News: pop reflow (74)

IPC Winter Webinar Series Offers Employee Training in the Comfort of a Company's Conference Room

Industry News | 2011-02-05 14:02:52.0

IPC announces its Winter Webinar Series for February and March 2011. Focused on technical challenges facing the electronics manufacturing industry, including lead-free reliability issues, high voltage PCB design, package on package (PoP) assemblies, PoP component manufacturing, thermal cycle testing and barrel failures, the one-hour webinars offer companies a great opportunity to bring IPC technical information to a large number of employees at one time.

Association Connecting Electronics Industries (IPC)

SMTA Announces February Webinars and Webtorials

Industry News | 2010-01-22 21:46:55.0

Minneapolis, MN - The SMTA is pleased to announce several new online presentations coming up in February. In response to industry-wide budget cuts and travel restrictions, SMTA has committed to increasing its online programming to better accommodate member needs for technical exchange.

Surface Mount Technology Association (SMTA)

Technical Library: pop reflow (3)

Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology

Technical Library | 2021-01-13 21:34:29.0

Package-on-Package (PoP) is a popular technology for fabricating chipsets of accelerated processing units. However, the coefficient of thermal expansion mismatch between Si chips and polymer substrates induces thermal warpage during the reflow process. As such, the reflow temperature and reliability of solder joints are critical aspects of PoP. Although Sne58Bi is a good candidate for low-temperature processes, its brittleness causes other reliability issues. In this study, an in-situ observation was performed on composite solders (CSs) made of ...

Osaka University

Reliability Evaluation of One-Pass and Two-Pass Techniques of Assembly for Package on Packages under Torsion Loads

Technical Library | 2021-12-16 01:52:32.0

Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the greatest benefits of PoP technology is the elimination of the expensive and challenging task of routing high-speed memory lines from under the processor chip out to memory chip in separate packages. Instead, the memory sits on top of the processor and the connections are automatically made during assembly. For this reason PoP technology has gained wide acceptance in cell phones and other mobile applications. PoP technology can be assembled using one-pass and two-pass assembly processes. In the one-pass technique the processor is first mounted to the board, the memory is mounted to the processor and the finished board is then run through the reflow oven in a single pass. The two-pass technique has an intermediate step in which the memory is first mounted onto the processor.

CALCE Center for Advanced Life Cycle Engineering

Videos: pop reflow (17)

Panasonic AM100 SMT Pick and Place Machine

Panasonic AM100 SMT Pick and Place Machine

Videos

Panasonic AM100 SMT Pick and Place Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place machine

Dongguan Intercontinental Technology Co., Ltd.

Hanwha SMT Pick and Place

Hanwha SMT Pick and Place

Videos

Hanwha SCM1-J SMT Feeder for Pick and Place Machine​ If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and pla

Dongguan Intercontinental Technology Co., Ltd.

Career Center - Resumes: pop reflow (3)

SMT process and equipment engineer

Career Center | BANGALORE, India | Engineering,Maintenance,Production

Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance

BankeemChheda-Resume

Career Center | Rochester, New York USA | Engineering

I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research

Express Newsletter: pop reflow (884)

SMTnet Express - December 13, 2018

SMTnet Express, December 13, 2018, Subscribers: 31,514, Companies: 10,659, Users: 25,503 Assembly Reliability of TSOP/DFN PoP Stack Package Credits: Jet Propulsion Laboratory Numerous 3D stack packaging technologies have been implemented

Package on Package (PoP) Stacking and Board Level Reliability, Results of Joint Industry Study

Package on Package (PoP) Stacking and Board Level Reliability, Results of Joint Industry Study News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Package on Package (PoP

Partner Websites: pop reflow (221)

SMT Reflow Oven History and Trends-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_industry,24567&url=_print

SMT Reflow Oven History and Trends-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin Reflow oven,SMT Reflow Soldering Oven 当前位置: Home >> News

How Challenging Conventional Wisdom Can Optimize Solder Reflow

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/00600-248.pdf

How Challenging Conventional Wisdom Can Optimize Solder Reflow With solder reflow, relying on commonlyaccepted practices can lead engineers tooverlook some relatively simple factors thatare critical

Heller Industries Inc.


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