SMTnet Express, June 12, 2014, Subscribers: 22834, Members: Companies: 13899, Users: 36331 Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow Arijit Roy; World Academy of Science, Engineering
SMTnet Express, February 2, 2017, Subscribers: 30,132, Companies: 15,113, Users: 41,841 What Type of PCB Substrate Material Is Right for Your PCB? Dora Yang; PCBCart Basic performance of PCB (Printed Circuit Board) depends on the performance
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes
Popcorn Crack 0299 PBGA Die Face Delaminations 0309 TSOP Die Cracks 0434 PQFPs Production Scanning 0759 TSOP Cracked Die 1009 PBGA Delaminations, Through Transmission 1011 PBGA Delaminations 1012 PBGA
Heller Industries Inc. | https://hellerindustries.com/component-cracking/
. Cracking of plastic-molded packages, such as QFPs and BGAs, sometimes called the popcorn effect is sometimes due to absorbed moisture in the thermoset plastic body but may also be due to a flaw in
