Industry Directory | Manufacturer
Multiaxis Distributed Motion Control uniquely integrating power and control into one compact module.
Industry Directory | Manufacturer
Transtector Systems provides a complete approach for the protection of communications systems and critical electronics from lightning and power anomalies. High speed data and signal protection, EMP |
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Electronics Forum | Fri Aug 07 18:09:55 EDT 2015 | bnorton
The power distribution board has 10 green LEDs on. By the time of the error SysFail is still on. Logicomm connected to the Force board COMM2 shows a stream of messages saying "Lantern system not active. Heart Beat = 0"
Electronics Forum | Tue Dec 22 00:11:41 EST 2020 | ttheis
Well it seems you are onto something with the vme power supply. The issue has resurfaced and I did notice the LED's on the keyboard went out when the issue occurs. I looked at the power distribution board to the left of the vme and it shows the +12V
Used SMT Equipment | Semiconductor & Solar
Power Control and Distribution Unit for Press System
Used SMT Equipment | General Purpose Test & Measurement
Battery-operated, high power Passive Intermodulation (PIM) testing solution for the major wireless standards in use around the world. The PIM Master’s small size and light weight, combined with battery operation, make it the ideal solution for verify
Industry News | 2003-06-12 08:48:13.0
Richardson Electronics named first worldwide distributor
Industry News | 2003-05-15 08:37:06.0
Recognition for helping to extensively grow Tyco Electronics' product sales from 2001 to 2002
Parts & Supplies | SMT Equipment
JUKI 503 507 nozzles JUKI E9635455000 REVISION SEAL JUKI E9635721000 FOCUSED MODULAR JUKI E9635725000 FOCUSE MODULAR LA UNIT JUKI E9635729000 PC joinER 8 CORES JUKI E9635755000 SPEED CONTROLLER FW231 JUKI E9636721000 FMLA SENSOR JUKI E96367250
Parts & Supplies | SMT Equipment
SMT PART E9629729000 4633N2020600 Z axis motor for JUKI E9627727000 CCD CAMERA CS4200J E9627729000 Z / THETA DRIVER (4 SHAFT FMLA) E9628727000 ROBOT CAMERA CABLE (5M) E9628729000 DRIVER (FOR 2 SHAFT FMLA) E96287800A0 M HEAD SENSOR ASM E9629729
Technical Library | 2024-07-24 00:51:44.0
A blade server system (BSS) utilizes voltage regulator modules (VRMs), in the form of quad flat no-lead (QFN) devices, to provide power distribution to various components on the system board. Depending on the power requirements of the circuit, these VRMs can be mounted as single devices or banked together. In addition, the power density of the VRM can be high enough to warrant heat dissipation through the use of a heat sink. Typically, at field conditions (FCs), the BSS are powered on and off up to four times per day, with their ambient temperature cycling between 258C and 808C. This cyclical temperature gradient drives inelastic strain in the solder joints due to the coefficient of thermal expansion (CTE) mismatch between the QFN and the circuit card. In addition, the heat sink, coupled with the QFN and the circuit card, can induce additional inelastic solder joint strain, resulting in early solder joint fatigue failure. To understand the effect of the heat sink mounting, a FEM (finite element model of four QFNs mounted to a BSS circuit card was developed. The model was exercised to calculate the maximum strain energy in a critical joint due to cyclic strain, and the results were compared for a QFN with and without a heat sink. It was determined that the presence of the heat sink did contribute to higher strain energy and therefore could lead to earlier joint failure. Although the presence of the heat sink is required, careful design of the mounting should be employed to provide lateral slip, essentially decoupling the heat sink from the QFN joint strain. Details of the modeling and results, along with DIC (digital image correlation) measurements of heat sink lateral slip, are presented.
Technical Library | 2020-10-08 00:55:22.0
This article presents the development of a stretchable sensor network with high signal-to-noise ratio and measurement accuracy for real-time distributed sensing and remote monitoring. The described sensor network was designed as an island-and-serpentine type network comprising a grid of sensor "islands" connected by interconnecting "serpentines." A novel high-yield manufacturing process was developed to fabricate networks on recyclable 4-inch wafers at a low cost. The resulting stretched sensor network has 17 distributed and functionalized sensing nodes with low tolerance and high resolution. The sensor network includes Piezoelectric (PZT), Strain Gauge(SG), and Resistive Temperature Detector (RTD) sensors. The design and development of a flexible frame with signal conditioning, data acquisition, and wireless data transmission electronics for the stretchable sensor network are also presented. The primary purpose of the frame subsystem is to convert sensor signals into meaningful data, which are displayed in real-time for an end-user to view and analyze. The challenges and demonstrated successes in developing this new system are demonstrated, including (a) developing separate signal conditioning circuitry and components for all three sensor types (b) enabling simultaneous sampling for PZT sensors for impact detection and (c)configuration of firmware/software for correct system operation. The network was expanded with an in-house developed automated stretch machine to expand it to cover the desired area. The released and stretched network was laminated into an aerospace composite wing with edge-mount electronics for signal conditioning, processing, power, and wireless communication.
Link:https://www.ascen.ltd/Products/mask_making_machine/ Automatic medical face mask making production machine to produce the finished face mask ,and to weld face mask by ultrasonic .From material feeding for produce face mask blank to welding the ea
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
Events Calendar | Tue Aug 27 00:00:00 EDT 2019 - Thu Aug 29 00:00:00 EDT 2019 | Sao Paulo, Brazil
The smarter E South America 2019
Events Calendar | Tue Aug 22 22:00:00 EDT 2017 - Thu Aug 24 20:00:00 EDT 2017 | Sao Paulo, Brazil
Intersolar South America 2017
Career Center | Charleston, South Carolina USA | Engineering,Maintenance
ELECTRICAL/ELECTRONICS ENGINEER II UEC is looking for an Electrical/Electronics II engineer who is motivated and enthusiastic about joining an engineering group which provides design and development of battery systems, power distribution systems,
Career Center | Folsom, California, California USA | Engineering,Maintenance
Senior Electrical Engineer Base Salary: $85-120K Full Benefits Bonus-Yes Relocation Assistance: Yes Interview Travel: NO * 5-7 years experience * Bachelors Degree *Travel: Occasionally Provide electrical engineering support to Operations, Developme
Career Center | Alexandria, Egypt | Engineering,Maintenance,Management,Technical Support
I am an adaptable and fast learner person, I have an experience of 5 years at manufacturing and management of people, a good team player who can communicate with others to get and give the best he can for the working place, I want to develop my self
Career Center | Danville, California | Sales/Marketing
Robert Riemer 129 Wilshire Ct. Danville, CA. 94526 (925) 820-6545 Home (925) 820-6546 Fax (925) 548-9633 Cell briemer@pacbell.net OBJECTIVE Seeking a challenging sales position with a dynamic company pursuing rapid, consistent growth in the electro
SMTnet Express, September 24, 2015, Subscribers: 23,507, Members: Companies: 14,658, Users: 39,014 Gold Stud Bump Flip Chip Bonding on Molded Interconnect Devices Dick Pang, Weifeng Liu, Anwar Mohammed, Elissa Mckay, Teresita Villavert and Murad
GPD Global | https://www.gpd-global.com/pdf/doc/Dispense-System-Service-Guide-22290008G.pdf
.......................................................................................2.1 Installation Procedure ........................................................................................2.2 Chapter 3: Start Up Power On ...........................................................................................................3.1 Homing the System
| https://productronica.com/en/trade-fair/key-topics/power-electronics/
Power electronics at productronica DE Deutsch English Discover productronica Trade fair topics PCB & EMS SMT Cables, Coils & Hybrids Semiconductor Future Markets Overall Production Support Data, Facts
