PPM introduces the QSV-W fully-automatic SMT assembler, delivering the largest board handling capability in the industry. The QSV-W is optimized for your large-board applications, performing superbly in low to medium mix applications with moderate nu
High-volume chipshooting operators with lower cost per placement, reduced machine maintenance, machine downtime and superior ppm performance. Main Features and benefits: Chipshooting at the smallest footprint Faster, smarter, easier, that counts for
Electronics Forum | Sun Apr 18 00:26:29 EDT 1999 | Vic Lau
| | | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | | | I consider "fines" individual unmelted metal sph
Electronics Forum | Sat Apr 17 12:00:12 EDT 1999 | John W
| | | | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | | | | | I consider "fines" individual unmelted metal spheres t
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2018-10-18 08:55:30.0
Nitrogen Protection Reflow Oven
Pick & Place for large PCB. Max PCB 36" x 60". Dual Nozzle, Laser Align, On the fly. Custom build, Windows 7 OS
SMTnet Express, July 14, 2016, Subscribers: 25,671, Companies: 14,887, Users: 40,690 Where PCBs and Printed Electronics Meet Chris Hunrath; INSULECTRO Printed Circuit Boards (PCBs) and Printed Electronics (PE) both describe conductor
GPD Global | https://www.gpd-global.com/features-illumination.php
Fluid Dispensing Equipment w/Automatic Vision Home Products Fluid Dispensing Equipment High Precision Dispenser -MAX Series Large Format Board Dispensing -DS Series Table Top Dispensing Equipment Loader
Lewis & Clark | https://www.lewis-clark.com/product/assembleon-iflex-complete-long-board-package-aoi-reflow-oven-and-handling-gear/
& Place, AOI, Reflow Oven and Handling Gear 2012 Assembleon iFlex Complete Long Board Package Including: Pick & Place, AOI, Reflow Oven and Handling Gear Make: Assembleon Model: IFlex – 3 modules Vintage: 2012 S/W level: 7.146 Modules: THREE Includes
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