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Industry Directory | Manufacturer
We are world leaders in the Selective Soldering industry, dedicated to developing pioneering technologies, such as our patented 1.5mm Micro Nozzle, to reflect and match the needs of an everchanging manufacturing marketplace.
Industry Directory | Equipment Dealer / Broker / Auctions
TrioTek™ inline, conveyor curing ovens from ETS are ideal for medium to high-volume curing/drying of coatings, adhesives and potting compounds.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Feature: 1. Heating rate could be adjustable for different products 2. Long life time thermode made of titanium alloy, ensure even temperature, fast raising 3. Thermode designed to be horizontal adjustment, ensure even component compression 4
Used SMT Equipment | Soldering - Selective
Vintage: 2010 Details: • Dual Solder Pot (Lead and Lead-Free) • Windows XP Operating System • Top Side Pre Heat • Bottom Side Pre Heat • Spray Fluxer • Includes Step down transformer • Includes (2) 8MM Nozzles Condition: Complete
Used SMT Equipment | Soldering - Selective
Pillarhouse Jade MKII Selective Soldering Machine Model: Jade MKII Year: 2016 Lead-Free Drop Jet Fluxer Top Side IR Pre-Heat Auto Soler Top-Up & Solder Level Detect Inerted Nitrogen System Thermal Nozzle Calibrati
Industry News | 2020-03-25 11:55:11.0
The Surface Mount Technology Association (SMTA) announced the recent release of Selective Soldering 101, the latest in a series of online training courses on the fundamentals of electronics assembly. The course will be useful for equipment operators, technicians, and engineers new to the industry that want to understand more about the soldering process and who have a basic familiarity with the equipment.
Industry News | 2018-10-18 08:17:09.0
How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process
Technical Library | 2016-01-12 11:01:25.0
More and more Land Grid Array (LGA) components are being used in electronic devices such as smartphones, tablets and computers. In order to enhance LGA mechanical strength and reliability, capillary flow underfill is used to improve reliability. However, due to the small gap, it is difficult for capillary underfill to flow into the LGA at SMT level. Due to cost considerations, there are usually no pre-heating underfill or cleaning flux residue processes at the SMT assembly line. YINCAE solder joint encapsulant SMT256 has been successfully used with solder paste for LGA assembly. Solder joint encapsulant is used in in-line LGA soldering process with enhanced reliability. It eliminates the underfilling process and provides excellent reworkability. The shear st rength of solder joint is stronger than that of underfilled components. The thermal cycling performance using solder joint encapsulant is much better than that using underfill. Bottom IC of POP has been studied for further understanding of LGA assembly process parameters. All details such as assembly process, drop test and thermal cycling test will be discussed in this paper.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Lead-Free SMT PCB LED Reflow Solder Oven ❙ Introduce of Reflow Oven High performance Reflow Oven, available in 6 zones, 8 zones and 10 zones. PC + Siemens PLC control system, first-class heating module. the reflow oven important parts use famous
Events Calendar | Wed Apr 07 18:30:00 UTC 2021 - Wed Apr 07 18:30:00 UTC 2021 | ,
Great Lakes Chapter Meeting: Flexible Wave Solder Processes and Optimization
SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Previous Page BGA REWORK Earl Moon Proof Of Design (POD) PRE OPERATIONAL REQUIREMENTS The following requirements shall
GPD Global | https://www.gpd-global.com/co_website/heatConfigurations.php
Contacts Technical Support About Company Profile News Events Awards Employment » System Models » DS Series » Dispensing Heated Applications Dispensing Heated Applications Ensure Uniform Heat Transfer and Dispense Effective Heated Applications Pre-Heat, Work Area Heat, and Post-Heat Pre-heat, work area heat
1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_wave_solder_specnor.html
Specnor Wave Solder Machine Specnor Fusion Wave Solder Machine Model 1800-N Year 2000 Spray Fluxer Dual Wave 2 Sections of Bottom Pre-Heat - One Section Top Pre-Heat Air Knife Nitrogen Low Hours Computer - Monitor - Several Accessories - ect
